Industry News: spi and aspire (Page 8 of 31)

PARMI Wins Award for New SPI Defect Repair Feature for SIGMA X New “Jet” module increases SPI throughput and ROI

Industry News | 2015-02-24 17:11:27.0

PARMI announces that it has been awarded a 2015 NPI Award in the category of Test & Inspection – SPI for its Jet Defect Repair Feature. This represents the third consecutive year that PARMI has received the award, which was presented during a Tuesday, Feb. 24, 2015 ceremony at the San Diego Convention Center during the IPC APEX EXPO.

PARMI

Viscom to Exhibit AOI/AXI Capabilities and New Process Uplink at SMTA International 2012

Industry News | 2012-09-13 13:58:17.0

Viscom will exhibit in Booth #415 at the upcoming SMTA International Exhibition,

Martel Marketing Communications, Inc.

Vi TECHNOLOGY to Demo Next-Generation SPI System and Sigma Review Software at NEPCON China

Industry News | 2015-03-17 12:04:05.0

Vi TECHNOLOGY will exhibit at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. WKK will exhibit the PI Series (SPI) in Stand B-1E10 and First Technology will exhibit the K Series (AOI) in Stand C1-1E05.

Vi TECHNOLOGY

Vi TECHNOLOGY to Display 3D SPI and Leading Technology at S.E.E.

Industry News | 2016-04-04 07:34:15.0

Vi TECHNOLOGY will exhibit PI-the new generation of 3D SPI as well as SIGMA Link, a powerful web-based software suite, in the Wretrom booth CO4:30 at the upcoming Scandinavian Electronics Event (S.E.E.) scheduled to take place April 19-21, 2016 in Sweden. Wretrom will represent Vi TECHNOLOGY at the show.

Vi TECHNOLOGY

Kasion and Smartop to Represent ASC International at NEPCON China

Industry News | 2014-04-22 13:36:21.0

ASC International announces that its products will be showcased in two booths at NEPCON China 2014, scheduled to take place April 23-25, 2014 at the Shanghai World EXPO Exhibition & Convention Center.

ASC International

Viscom presents the most advanced and comprehensive range of high-speed 3D AOI, SPI and AXI inspection systems at Nepcon South China.

Industry News | 2014-07-28 12:42:54.0

Viscom will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #A-1C36 at Nepcon South China. Viscom S3088 AOI and SPI systems are designed to flexibly cover even the most challenging requirements, from small series production to high-volume/low-mix. The new XM-3D camera module allows for especially fast inspections, with both high-resolution angled views and 3D analyses.

Viscom AG

CyberOptics to Showcase World’s Fastest AOI System and Newest SPI System at NEPCON South China 2010

Industry News | 2010-08-10 14:30:52.0

CyberOptics Corporation (NASDAQ: CYBE) will feature its latest award winning SPI and AOI In-Line inspection Systems at the upcoming NEPCON South China 2010 scheduled to take place on August 31- September 2, 2010 at the Shenzhen Convention & Exhibition Centre.

CyberOptics Corporation

ASC International Highlights 3D SPI and AOI at SMTA International Expo

Industry News | 2022-10-04 11:08:34.0

ASC International announces that it will exhibit at the SMTA International - Electronics Manufacturing Conference and Exposition – November 2-3, 2022 in Minneapolis. ASC International will offer live demonstrations of its industry-leading SPI and AOI solutions. The VisionPro M500, VisionPro AP500, VisionPro Merlin and the LineMaster Fusion 3D – the industry's most cost-effective inline 3D SPI system at under $50K – will all be available for hands-on presentations.

ASC International

Essemtec Provides High-Resolution SPI for Printing and Dispensing Processes

Industry News | 2011-05-27 21:57:47.0

Traqu is a high-resolution digital 3-D inspection device from Essemtec used for 3-D measurement and analysis in processes such as solder paste inspection (SPI). Measurement tasks are programmed with a few mouse clicks, and DXF and Gerber data can be imported.

ESSEMTEC AG

KIC in Booth #3101 at SMTAI: Solutions for Reflow and Wave Soldering Optimization, Inspection and Traceability

Industry News | 2021-10-07 15:10:50.0

KIC will exhibit in Booth #3101 at SMTA International, scheduled to take place Nov. 3 - 4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Along with Reflow Process Inspection (RPI) and Wave Solder Process Inspection (WPI), the KIC team will discuss NPI setup, process optimization for reduced defects, improved OEE, and their complete ecosystem of solutions for thermal processes.

KIC Thermal


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