Industry News | 2022-01-03 07:24:21.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Industry News | 2018-12-18 20:58:42.0
Indium Corporation’s Fiona Chen, Manager of Research & Development, will deliver a presentation at ELEXCON 2018, December 20-22 in Shenzhen, China.
Industry News | 2022-02-10 17:05:35.0
The development of a novel high-temperature lead-free solder for die-attach in power discrete applications will be the focus of a presentation by Indium Corporation's Dr. HongWen Zhang at APEC 2022, March 20-24, Houston, Texas, U.S.
Industry News | 2022-05-16 16:04:54.0
New Vishay MCB RAME012 Position Sensor Delivers High Performance in Miniature Size for Military and Industrial Applications
Industry News | 2022-06-24 10:24:20.0
CyberOptics® Corporation (NASDAQ: CYBE) will exhibit at SEMICON West 2022 HYBRID, scheduled to take place July 12–14, 2022 at the Moscone Center in San Francisco and online 24/7. The company will launch its next-generation WaferSense® Auto Teaching System™ (ATS2) and new ReticleSense® Auto Teaching System™ (ATSR) in Booth #1241.
Industry News | 2013-05-31 08:44:29.0
CyberOptics Corporation (Nasdaq: CYBE) announces that its representative Dual Matrix will display its award-winning QX100™ tabletop AOI system in booth #D5, at NEPCON Malaysia, June 10-12, 2013 at the Penang International Sports Arena (PISA).
Industry News | 2022-05-05 17:06:12.0
Heraeus Electronics today announced that Susanne Klaudia Duch, Project Leader Development - Copper Sinter Paste, and Dennis Ang, Global Product Manager - Die Attach and Sinter Products, Heraeus Electronics, will present during the E-Mobility Forum at PCIM Europe. The presentation entitled, "How Near is Copper Sintering?" is scheduled to take place May 10, 2022 at 11:20 a.m.
Industry News | 2022-09-14 11:09:23.0
Indium Corporation's Evan Griffith, product specialist for semiconductor and advanced assembly materials, will host a webinar about the fundamentals of flip-chip bonding at 10 a.m. New York, Thursday, Sept. 15, as part of the company's webinar program--the InSIDER Series.
Industry News | 2022-04-20 14:44:31.0
Indium Corporation's Brian O'Leary, global accounts manager and global head of e-Mobility and infrastructure, will be presenting on market trends in the thriving electric vehicle (EV) landscape at the SMTA Michigan Expo & Tech Forum at 9 a.m. local time, Tuesday, May 17, Livonia, Mich., U.S.
Industry News | 2022-01-29 13:20:07.0
Durafuse™, Indium Corporation's award-winning mixed-alloy technology, will be the focus of a virtual presentation by Dr. HongWen Zhang for the Institution of Engineers, Malaysia at 8 a.m. New York/9 p.m. Malaysia on Thursday, Feb. 24.
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
611 Hollingsworth Street
Grand Junction, CO USA
Phone: (970) 245-0408
