Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2003-03-06 08:43:16.0
Under pressure to fulfill growing repair obligations in the United States, some OEMs and EMS companies are outsourcing projects to product-lifecycle managers.
Industry News | 2003-06-16 08:33:59.0
This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.
Industry News | 2018-10-18 08:39:14.0
Stencil Technology for SMT production
Industry News | 2012-08-08 17:44:58.0
IPC Recently released, IPC-7527 was the brainchild of Task Group Nordic (TGNordic), IPC’s volunteer standards development group in Scandinavia.
Industry News | 2012-12-13 13:23:38.0
IPC-7527, Krav til Tinpastatryk, is also the first standard ever developed that focuses on the application of one of the industry’s most basic infrastructure elements, solder paste.
Industry News | 2012-08-30 20:34:57.0
The SMTA announced the Doctor's Hours program will be held for the third consecutive year at SMTA International, taking place October 14-18, 2012 in Orlando, FL
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Industry News | 2020-04-18 14:12:00.0
IPC yesterday sent a letter to U.S. President Donald Trump, Mexican President Andrés Manuel López Obrador and Canadian Prime Minister Justin Trudeau, urging them to launch a trilateral initiative to mobilize industrial base support for the continuing medical response related to COVID-19.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
