Industry News | 2019-11-13 12:32:13.0
Laserssel Co., LTD announces that it was awarded a 2019 Global Technology Award in the category of Soldering – Selective for its LSR (Laser Selective Reflow). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany
Industry News | 2019-11-20 10:52:13.0
$100 Million. The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during Productronica in Munich, Germany. This is the fourth time that NEO Tech has been selected for this award.
Industry News | 2020-01-22 16:55:47.0
Europlacer is renowned industry-wide for its exemplary support infrastructure, a truth officially recognised by six consecutive annual Service Excellence Awards. Now the company’s commitment to Continuous Improvement sees the creation of a new role to specifically support key account customers – a post filled by Europlacer Service, Support & Engineering veteran Mark Bartholomew.
Industry News | 2020-02-18 15:01:47.0
SAKI's software for inspection data analysis improves manufacturing quality and control
Industry News | 2020-09-06 04:35:38.0
The electronics industry is always looking for faster, better and cheaper manufacturing techniques. Central to progressing this ideal in the future will be Artificial Intelligence (AI), a core element of the Industry 4.0 revolution. To ensure they are ready and at the forefront of this technology transformation, Altus Group, a leading distributor of capital equipment in the UK and Ireland, has a number of highly advanced applications which have been designed to covert data into information that will benefit the industry.
Industry News | 2021-07-08 05:33:04.0
Laserssel Co., LTD is pleased to introduce its CLSR 6000 high-end Laser Compression Bonder for semiconductor packages. This soldering technique uses high accuracy compression tools and Area Laser bonding introduced with LSRTM(Laser Selective Reflow) in order to minimize warpage on extremely thin packages and substrates. This technology has been adopted for high-end 2.5D packaging with dimensions larger than 60x60mm and NAND modules thinner than 50 µm.
Industry News | 2021-11-03 13:33:10.0
Laserssel Co., LTD is pleased to announce that it received two 2021 Mexico Technology Awards in the categories of Bonding Equipment for its LCB 3000 Laser Compression Bonder and Rework & Repair for its Laserssel rLSR Mini LED Rework System. The awards were announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.
Industry News | 2023-02-06 14:32:21.0
MicroCare today announced the promotion of Ernesto Pollano to General Sales Manager, Mexico / LATAM. The promotion speaks to the company's strategy to continue to build upon its global expansion.
Industry News | 2023-05-03 09:01:22.0
Tresky GmbH from Hennigsdorf near Berlin will present its newly developed pre-sintering processes at this year's pcim EUROPE in Nuremberg. As assemblies with high-performance semiconductors represent a key technology for the global energy turnaround and electromobility, Tresky has been working on these manufacturing processes for some time and will present further product and process innovations in 2023 as part of additional development steps.
Industry News | 2023-11-20 15:38:12.0
The German DIE Bonder specialist is launching its brandnew website with a fresh corporate design for productronica 2023. The new website includes different focus and structure for the bonder solutions, which should help selecting proper information.
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