Industry News: stabilize (Page 13 of 61)

Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2

Industry News | 2017-01-11 17:03:45.0

Essemtec today announced plans to exhibit in Booth #1223 at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in Calif. Essemtec will debut the FOX² and demonstrate the compact Spider jet dispenser.

ESSEMTEC AG

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Industry News | 2017-02-21 15:59:49.0

Essemtec announces that it has been awarded a 2017 NPI Award in the category of Component Placement – Multifunction for its FOX2. The award was presented to the company during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO. This marks the 15th industry award that the Swiss manufacturer has received in recognition of its production systems for electronic assembly and packaging. The new FOX2 by Essemtec combines jetting of solder paste or glue and placement in a single machine. The new version is based on the original award-winning platform, which is the first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.

ESSEMTEC AG

Epec Hires New User Interface Product Manager

Industry News | 2017-04-24 15:06:10.0

[April 25, 2017: New Bedford, MA] With the latest enhancement in SMART Human-Machine Interface (HMI) technologies and to better assist customers' needs, Epec recently announced the hiring of Steve Goodman, the new User Interface Product Manager.

Epec Engineered Technologies

KIC to Showcase New Integrated Fixture and Profiler for Tracking Reflow Oven Stability at NEPCON China

Industry News | 2019-03-25 19:51:31.0

KIC today announced plans to exhibit in Booth 1G10 at NEPCON China, scheduled to take place April 24-26, 2019 at the Shanghai World Expo Exhibition & Convention Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0

KIC Thermal

KIC to showcase new integrated fixture and profiler designed for tracking reflow oven stability at NEPCON Asia

Industry News | 2019-08-08 08:16:10.0

KIC today announced plans to exhibit in Booth 1C01 at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. Company representatives will showcase the new SRA (Smart Reflow Analyzer) and RPI i4.0

KIC Thermal

Saelig Adds New Rigol DSG3000B Series 6.5/13.6GHz RF Signal Generators

Industry News | 2020-10-14 12:29:06.0

The DSG3000B RF Signal Generator series simplifies high power setup since an external amplifier is not needed. Engineers can generate more complex signals without additional hardware using the modulation schemes supplied in the DSG3000B with both internal and external IQ modulation capabilities.

Saelig Co. Inc.

Temperature Cycling Test Chambers: Product Stability Test When Exposed to Extreme Temperature

Industry News | 2020-11-19 20:55:18.0

Temperature cycling test or thermal cycle testing is done on substances to determine the immunity of vulnerability to alternating extremes of low and high temperatures. You can utilize temperature cycling test chambers to test nearly all commercial goods to determine how they withstand extreme temperature changes. The intent of analyzing a product under these conditions is to detect changes in the goods' characteristics and assess the failure incidence of distinct substances and thermal expansion coefficients.

Guangdong Bell Experiment Equipment Co.,Ltd

Ohmcraft Delivers High Performance Leaded Dividers for Mission Critical Applications

Industry News | 2021-05-11 15:02:31.0

New Yorker Electronics Releases Exxelia Ohmcraft HVD Resistor Series with Voltage Ratings to 40kV and Resistance Values to 2TΩ

New Yorker Electronics

Heraeus Electronics Introduces Optimized Copper Ribbon for Laser Bonding at PCIM Europe

Industry News | 2022-05-18 13:01:33.0

Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.

Heraeus

New Yorker Electronics Reveals Promising Option for Hard-To-Find Oscillator Devices

Industry News | 2022-06-08 15:03:39.0

Raltrons' XCO Series Oscillators Deliver in 4 Weeks When Other Manufacturers Have 50 - 60 Weeks Lead Times

New Yorker Electronics


stabilize searches for Companies, Equipment, Machines, Suppliers & Information