Industry News: stabilize (Page 15 of 53)

Polyonics Premiers Four New Materials

Industry News | 2009-04-15 16:24:57.0

WESTMORELAND, N.H. � April 2009 �Polyonics introduces four new materials to help win over new and existing projects.

Polyonics, Inc.

Henkel Launches New High-Temp Compatible Conductive Film for RF Grounding Applications

Industry News | 2009-06-08 23:35:30.0

Advancing the performance of electrically conductive film technology, Henkel has developed and launched Emerson & Cuming� CF3366�, a ground-breaking film technology that offers a robust alternative to traditional conductive materials.

Henkel Electronic Materials

Galaxy Thin Wafer System from DEK Enhances Process Capability for HVM Thinned Wafer Applications

Industry News | 2009-08-04 16:28:40.0

2 @ +/- 12.5µm and advanced speed and acceleration control to ensure robust processing of today’s delicate wafer products.

ASM Assembly Systems (DEK)

DEK Galaxy Platform Enables LORD Corporation’s Product Development Initiatives

Industry News | 2009-08-20 15:26:58.0

To progress development of its next-generation pre-applied underfill materials, LORD Corporation has selected DEK’s award-winning Galaxy platform. LORD, a Cary, North Carolina-based leading manufacturer of electronic materials, found the precision, accuracy and process capability of the Galaxy simply unmatched and, therefore, the ideal system to enable its materials innovation initiatives.

ASM Assembly Systems (DEK)

Henkel Introduces Zero Halogen Multicore HF108 Solder Paste

Industry News | 2009-11-24 22:07:52.0

Henkel’s in-depth materials development initiatives surrounding halogen-free innovation has yielded another process-enabling product. Multicore HF108 is a lead-free, halogen-free solder paste that combines all of the benefits of robust lead-free materials with the advantage of no deliberately added halogen and is now commercially available.

Henkel Electronic Materials

LORD Corporation Advances Materials Development with DEK Galaxy and Wafer Transport Solution

Industry News | 2010-08-17 14:51:15.0

Enjoying the materials innovation success it has realized with its first DEK Galaxy system, Cary, North Carolina-based LORD Corporation recently expanded its development capacity with the addition of a second Galaxy equipped with DEK’s new Wafer Transport Solution.

ASM Assembly Systems (DEK)

Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

Industry News | 2011-01-14 13:06:07.0

Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

MAZeT Trade Fair Review 2012

Industry News | 2013-01-24 14:23:23.0

By attending trade fairs, MAZeT used 2012 to boost its profile as a provider of electronic development and production for embedded systems, opto-ASICs and spectral sensors for LED light in the selected target markets. The number and localization of the events attended highlight this.

MAZeT

ADLINK Releases SMARC Module LEC-BT Running Intel® Atom™ Processor E3800 Series System-on-Chip

Industry News | 2014-07-23 13:15:08.0

ADLINK Technology today introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability.

ADLINK Technology, Inc.


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