Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Industry News | 2018-07-10 20:52:09.0
High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.
Industry News | 2019-11-05 22:26:14.0
The board stack-up is probably the most essential piece for ensuring a successful PCB design. Modern high-speed boards require controlled-impedance traces, and whether you are using a simulation tool, a simple calculator, or the back of a napkin, you need to understand your manufacturing process to correlate your impedance calculations. This ensures that your trace widths and dielectric heights match what will actually be manufactured, and eliminates last-minute design changes.
Industry News | 2019-11-05 22:20:35.0
8 Layer PCB Stack-up Guidelines How to improve EMC performance on 8 layer PCB design? The following text is reproduced, with permission, from Part 4 of a 6-Part article on PCB Stackup by Henry W. Ott. The original article is available at http://www.hottconsultants.com/tips.html
Industry News | 2011-05-03 21:30:43.0
Microscan introduces a free online barcode generator that allows visitors to create, save and email custom barcodes from the Microscan website.
Industry News | 2019-11-05 22:05:41.0
The printed circuit board, or PCB, is responsible for connecting all the components with each other in your electronic assembly. Making just one tiny error in the design could lead to complete failure. PCB layout design requires ardent precision and great technological skills.
Industry News | 2025-10-01 16:51:02.0
Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2025, scheduled to take place October 7-9th at the Phoenix Convention Center in Arizona. Visitors to booth 5745 will have the opportunity to see demonstrations of Nordson's WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), Gen 7™ Acoustic Micro Imaging (AMI) system and 4800 Integra Bond Tester.
Industry News | 2008-06-12 22:54:58.0
Agilent Technologies Inc. (NYSE: A) today announced new software capabilities for its E2960B Series protocol analyzer and LTSSM exerciser solution. The software package supports the PCI-SIG Single-Root I/O Virtualization (SR-IOV) and Multi-Root I/O virtualization (MR-IOV) specifications and builds on the PCI Express(r) (PCIe(r)) protocol stack, which makes it possible to run multiple systems' images on a common hardware platform.
Industry News | 2025-11-03 14:30:58.0
Nordson TEST & INSPECTION today announced plans to exhibit with distributor partners at Productronica and SEMICON Europa, scheduled to take place November 18-21 at the Messe Munchen in Munich, Germany. Visitors to SmartTec's booths #A2.540, A2.537 and HTT's booth # B1.102 will have the opportunity to see demonstrations of Nordson's WaferSense® semiconductor sensors, SQ5000™Pro Multi-Function system for AOI, SPI and CMM, Quadra Pro™ Manual X-Ray system (MXI), Gen 7™ Acoustic Micro Imaging (AMI) system and X3 Automated X-Ray (AXI) system with Dynamic Planar CT.
Industry News | 2017-01-15 19:31:24.0
Saline Lectronics today announced that it has purchased and installed a Nikon Metrology XT V 160 Varian 1313Dx X.Tract PCB inspection system with the Advanced Service Kit, AutoTransformer, and Inspect-X Software. This new system will better enable Lectronics to provide customers with fast, automated 3D component inspection.
