Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Industry News | 2018-10-18 11:09:41.0
Advantages of Design for Manufacturability Rules
Industry News | 2017-08-06 19:39:48.0
The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2003-09-11 16:50:12.0
The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer
Industry News | 2018-07-10 20:52:09.0
High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.
Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Industry News | 2018-10-18 11:01:38.0
What Design Files Are Necessary for PCB Manufacturing & Assembly?
Industry News | 2019-11-05 22:20:35.0
8 Layer PCB Stack-up Guidelines How to improve EMC performance on 8 layer PCB design? The following text is reproduced, with permission, from Part 4 of a 6-Part article on PCB Stackup by Henry W. Ott. The original article is available at http://www.hottconsultants.com/tips.html
Industry News | 2019-11-05 22:26:14.0
The board stack-up is probably the most essential piece for ensuring a successful PCB design. Modern high-speed boards require controlled-impedance traces, and whether you are using a simulation tool, a simple calculator, or the back of a napkin, you need to understand your manufacturing process to correlate your impedance calculations. This ensures that your trace widths and dielectric heights match what will actually be manufactured, and eliminates last-minute design changes.
Industry News | 2019-06-15 22:32:38.0
EMS introduces a revolutionary improvement in durability for printed electronics. EMS inks and adhesives have been designed for compatibility in chemistry and mechanical stress. The unique stack-up design channels paste placement for fillet strength and higher yield with smaller devices.
