Industry News: stencil design for qfns (Page 1 of 22)

SMTAI Call for Papers

Industry News | 2009-03-12 18:25:36.0

The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.

Surface Mount Technology Association (SMTA)

SMTA International Call for Papers

Industry News | 2010-02-17 18:45:59.0

The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.

Surface Mount Technology Association (SMTA)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

Session 6 Agenda Is Finalized for the High-Rel Cleaning and Coating Conference Hosted by IPC and SMTA

Industry News | 2012-11-07 11:01:55.0

IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Contributions to Electronics Manufacturing Industry and IPC

Industry News | 2012-02-28 14:00:06.0

IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Industry News | 2024-03-27 09:07:10.0

The world of PCB assembly is constantly evolving, and Red Glue SMT Solutions offer a revolutionary approach for double-sided printed circuit board assemblies (PCBAs). This innovative technique overcomes limitations of traditional solder paste and reflow ovens, paving the way for increased efficiency and cost savings.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Industry News | 2018-04-17 21:06:54.0

SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 5-7, 2018 in Markham, Ontario, Canada.

Surface Mount Technology Association (SMTA)

IPC Releases IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)

Industry News | 2021-02-15 14:41:46.0

– The long-awaited release of IPC-7093A, Design and Assembly Process Implementation for Bottom Termination Components (BTCs)is here. Revision A is a complete overhaul of IPC-7093 which provides design and assembly guidance for implementing BTCs and focuses on critical design, materials, assembly, inspection, repair, quality, and reliability issues.

Association Connecting Electronics Industries (IPC)

Come. Focus. Participate in the industry's best conference. The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference.

Industry News | 2010-05-07 16:01:14.0

New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.

Surface Mount Technology Association (SMTA)

MPM Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers

Industry News | 2020-04-14 22:07:07.0

ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the side-clamming capability on the Edison.

ITW EAE

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