Industry News: stencils bga (Page 6 of 14)

APS Novastar Introduces Automated Vision Control for L-Series Pick and Place Systems

Industry News | 2008-10-07 12:56:56.0

APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.

DDM Novastar Inc

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth # 505 Introduces PF606-P116 / PF606-P128 / PF606-XP LED Die Bonding Solder Pastes

Industry News | 2016-06-05 13:20:49.0

SHENMAO PF606-P116 Halogen Free Water Soluble LED Die Bonding Solder Pastes are made locally in the USA and with the same quality in 8 other worldwide locations.

Shenmao Technology Inc.

YINCAE's New NC 256 Zero Residue Flux

Industry News | 2019-08-19 15:02:03.0

YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.

YINCAE Advanced Materials, LLC.

Gen3 Systems’ Products to be Displayed by Ascentech LLC at SMTAI in Booth #219 and at the Special SMTAi Feature Area

Industry News | 2015-09-30 16:26:02.0

Gen3 Systems Limited will exhibit both GEN3 Systems’ products and Optilia Inspection equipment in Booth #219 at the SMTA International Conference and Exhibition, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Ascentech LLC also will participate in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience on the show floor. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.

Gen3 Systems

Austin American Technology Announces Merger with Aqua Klean Systems

Industry News | 2023-02-20 18:54:20.0

Industry leaders in the Electronic Manufacturing field, Austin American Technology (AAT) and Aqua Klean Systems (AKS), are excited to announce a merger. As manufacturers of cleaning equipment, the former competitors have joined forces to become the world's largest and only full-service electronics cleaning equipment manufacturer. Both companies serve the automotive, medical, military and aerospace industries, and this merger is expected to further improve the high level of service clients have come to expect. Operation will continue at both facilities in Austin, TX and Anaheim, CA, while retaining all employees.

Austin American Technology

FCT Solder to Highlight SLIC� Paste at SMTA International 2008

Industry News | 2008-08-04 13:01:17.0

GREELEY, CO � August 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, announces that it will display SLIC� Paste in booth 125 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando, FL.

FCT ASSEMBLY, INC.

Aqueous Technologies Receives Best Paper Recognition at SMART Group BGA and Cleaning Reliability Conference

Industry News | 2011-10-25 00:31:18.0

Aqueous Technologies announces that CEO Michael Konrad was voted Best Paper by delegates at the recent SMART Group Conference at the Oxfordshire Golf Club in Thame, UK.

Aqueous Technologies Corporation

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

SHENMAO Offers Water-Soluble Solder Paste for SMT and IC Packaging Applications

Industry News | 2019-05-27 21:16:27.0

SHENMAO America, Inc. introduces PW215 Water Soluble Solder Paste, ideal for SMT and IC packaging applications. With a wide reflow window, this water soluble solder paste can effectively fit into the design process for even the most complex SMT or IC assembly substrate designs.

Shenmao Technology Inc.

SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

Industry News | 2022-06-24 10:13:15.0

SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

Shenmao Technology Inc.


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