Industry News: step up stencil (Page 8 of 125)

SMTA International Features Package-on-Package (PoP) Design and Assembly Center and Free Webinar

Industry News | 2012-07-12 10:34:27.0

The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.

Surface Mount Technology Association (SMTA)

SMTA International Features Package-on-Package (PoP) Design and Assembly Center and Free Webinar

Industry News | 2012-07-12 10:34:54.0

The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.

Surface Mount Technology Association (SMTA)

IPC Summit to Address American Competitiveness

Industry News | 2011-03-21 12:32:41.0

The IPC Summit on American Competitiveness will be held June 15-16, 2011, in Washington, D.C. at the Hyatt Regency on Capitol Hill. This unique IPC event combines conference presentations with legislative and regulatory briefings as well as key lobbying visits with members of Congress to discuss critical issues that directly impact the U.S. electronics industry’s ability to compete globally. As a part of the two-day Summit, exclusive events with members of the National Association of Manufacturers will offer opportunities to hear from and network with members of Congress and senior-level Administration officials.

Association Connecting Electronics Industries (IPC)

Made in Japan: Solder Paste Jet Dispensing Machine

Industry News | 2024-03-19 07:59:17.0

Step into the future of manufacturing with the Solder Paste Jet Dispensing Machine, meticulously crafted in Japan under the esteemed I.C.T brand. This cutting-edge equipment represents the pinnacle of precision engineering, delivering unrivaled performance and reliability. Let's dive into its exceptional features and applications.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Four IPC Global Statistical Programs Now Open

Industry News | 2015-03-11 14:26:45.0

IPC’s global statistical programs for the laminate, solder, process consumables and assembly equipment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC-member companies as a benefit of membership.

Association Connecting Electronics Industries (IPC)

IPC Releases T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Industry News | 2015-06-18 17:23:06.0

IPC Association Connecting Electronics Industries® has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever evolving standard provides common language of terms and definitions for the electronics industry.

Association Connecting Electronics Industries (IPC)

New IPC Report Examines Opportunities and Risks in the Latin American Electronics Industry

Industry News | 2013-02-06 07:01:20.0

Latin America: Regional Outlook for the Electronics Industry, a new report published by IPC—Association Connecting Electronics Industries®.

Association Connecting Electronics Industries (IPC)

IPC News: Zentech Manufacturing First to Earn Certification as Qualified Manufacturer to IPC J-STD-001 Space Addendum

Industry News | 2014-10-13 08:59:23.0

IPC’s Validation Services Program has awarded an IPC J-STD-001 Space Addendum Qualified Manufacturers Listing (QML) to Zentech Manufacturing Inc., an electronics and engineering service firm in Baltimore, Md.

Association Connecting Electronics Industries (IPC)

SMTA International Program Finalized and Registration Is Now Open!

Industry News | 2015-06-11 22:59:06.0

The SMTA International Technical Committee has finalized their best program to date and registration is now open. The conference will include 130 papers, 19 short courses, and three focused symposiums. Start planning now to attend SMTA International this fall!

Surface Mount Technology Association (SMTA)

IPC Delivers the First Automotive Standard on Performance Requirements for Rigid Printed Boards

Industry News | 2016-06-27 14:54:49.0

In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)


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