Industry News | 2021-01-27 04:51:26.0
IPC is applauding the U.S. Department of Defense (DoD) for establishing a new Defense Electronics Consortium (DEC).
Industry News | 2021-06-24 06:53:46.0
IPC Survey Finds Many May Exit the Defense Market Due to High Costs Associated with Cyber Certification
Industry News | 2021-06-30 04:22:34.0
EMS and OEM companies interested in integrating IPC-CFX on existing assembly lines now have access to a portal listing equipment vendors and their support of IPC-CFX on specific legacy equipment models in the field. This portal currently lists more than 120 models or series for which vendors have indicated they can provide either direct software or add-on hardware support.
Industry News | 2021-09-30 16:43:41.0
IPC-1402 reflects industry commitment to advance green electronics and workplace safety
Industry News | 2022-02-07 17:08:10.0
In recognition and acknowledgment of his extraordinary contributions to IPC and the electronics industry, Joe O'Neil, OAA Ventures, was presented with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO on Tuesday, January 25. IPC's most prestigious award, the Hall of Fame is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Industry News | 2022-02-25 14:40:53.0
The electronics manufacturing industry is applauding a set of U.S. Government reports on strategic supply chains, released today, which highlight the need for the United States to foster a robust domestic electronics manufacturing industry.
Industry News | 2022-06-24 10:28:23.0
IPC's draft version of IPC-1402, Standard for Green Cleaners Used in Electronics Manufacturing, is now open for public review. The draft standard has been progressing through the standards process since fall of 2021 and, despite some minor delays in the draft development timelines – delays are common during consensus-based standards development processes – the draft is now ready for public review through July 15, 2022.
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
Industry News | 2022-08-14 14:18:23.0
The following statement is issued by John Mitchell, IPC president and CEO, to comment on President Biden's signature today on the "CHIPS and Science Act" in Washington, D.C.:
Industry News | 2022-08-26 08:58:41.0
IPC's Design for Excellence (DFX) guidelines document, IPC-2231 provides a framework to establish a design review process for the layout of printed board assemblies. This design review assesses the manufacturability attributes of printed boards, namely design for manufacturing, fabrication, assembly, testability, cost, reliability, environment, and reusability. IPC is aware of the responsibilities that electronics manufacturing companies will soon have to regulatory bodies around the world as well to the environment.
