Industry News | 2006-07-12 15:07:26.0
ENDICOTT, NY
Industry News | 2007-10-16 12:12:59.0
Pressurex Reveals surface pressure distribution and magnitude
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Industry News | 2021-03-31 11:09:20.0
Vishay Siliconix New AEC-Q101-qualified P-Channel -80V TrenchFET MOSFET Reduces Energy Waste and Increases Power Density with Industry-Low On-Resistance
Industry News | 2021-08-26 11:17:24.0
Indium Corporation's Leo Hu, senior area technical manager – East China, will share insights on tool-free solder preform technology for power module assembly during a poster session at PCIM Asia, Sept. 9-11, Shenzhen, China.
Industry News | 2022-04-08 11:00:33.0
KDPOF Celebrates In-vehicle Network Standardization Progress Reaching IEEE 802.3 Working Group Ballot Stage
Industry News | 2022-12-21 10:42:04.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #1433 at the IPC APEX Exposition, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in San Diego, CA. The company also will showcase LF-C2 P608 solder paste.
Industry News | 2024-02-19 11:47:54.0
As one of the leading materials providers to the power electronics assembly industry, three Indium Corporation team members will share their insights and knowledge on a variety of industry-related topics throughout APEC 2024, February 25-29, in Long Beach, CA.
Industry News | 2014-06-26 20:12:53.0
Isola Group announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100 Gigabit Ethernet (100GbE) at data rates in excess of 25 Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis coefficient of thermal expansion (CTE) on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers.
Industry News | 2009-04-23 21:31:21.0
W�rth Elektronik's cantilever sensors revolutionise applications such as ERP and identification systems
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