Industry News: stress test (Page 4 of 16)

Seika to Introduce New PCAS-1000A Stress Measurement Kit at APEX

Industry News | 2018-01-31 07:56:57.0

Seika Machinery today announced plans to introduce the new KYOWA ELECTRONIC INSTRUMENTS CO., LTD. PCAS-1000A Stress Measurement Kit. Company representatives will show the kit for the first time in Booth #2043 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca.

Seika Machinery, Inc.

Advances in Thin, 3D and MEMS Die Bond Strength Testing

Industry News | 2017-08-02 07:12:18.0

As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:

XYZTEC bv

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Industry News | 2024-03-26 13:28:39.0

ZESTRON will be presenting at the upcoming IPC APEX Expo on the critical challenges and innovations in high-voltage (HV) electronic assemblies within the realm of E-Mobility. The presentation, titled "EV Electronics: Design, Manufacturing, and Reliability Challenges," will feature industry expert Olaf Schoenfeld, Ph.D., and will take place from 11:30 AM to 2:00 PM on Thursday, April 11.

3M Electrical Solutions Division

SECOND CALL FOR PARTICIPATION - Workshop on Testing of Lead-Free Assemblies

Industry News | 2009-01-30 19:00:08.0

The University of Maryland Center for Advanced Life Cycle Engineering (CALCE) is pleased to announce that it will host a workshop on the testing of lead-free soldered assemblies. The primary goal of the workshop is to provide a forum of technical exchange regarding experiences, lessons learned, data, and other information on testing of lead-free electronic assemblies.

CALCE Center for Advanced Life Cycle Engineering

Breakthrough Indentation Yield Strength Test

Industry News | 2011-07-26 17:11:30.0

Nanovea introduced its patent pending breakthrough method of reliably acquiring yield strength through indentation; ultimately replacing the traditional tensile testing machine for yield strength measurement.

NANOVEA

Indium Corporation's Technology Experts to Present at IPC Conference on Solder and Reliability

Industry News | 2013-11-08 17:55:20.0

Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13-14 in Costa Mesa, California.

Indium Corporation

Vibration and Shock course

Industry News | 2001-05-28 18:57:46.0

Billerica (Boston), USA

Equipment Reliability Institute - ERI


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