Industry News: stress test (Page 10 of 16)

Universal Instruments’ APL Hosts AREA Consortium Meeting

Industry News | 2009-11-06 17:20:54.0

Universal Instruments’ Advanced Process Lab hosted the third 2009 Advanced Research in Electronics Assembly (AREA) Consortium meeting at the Treadway Inn in Owego, NY on October 28-29. More than 75 attendees from the 29 member companies participated in the two-day event and a much larger number has signed up for subsequent webcasts of the presentations. Topics ranged from lead-free solder microstructure and reliability to environmental stress screening procedures.

Universal Instruments Corporation

Pickering Interfaces Expands Range of PCI Precision Programmable Resistor Solutions

Industry News | 2014-07-16 11:29:31.0

Pickering Interfaces, a leading provider of modular signal switching and instrumentation for use in electronic test and simulation, is expanding its range of PCI precision programmable resistor solutions with the introduction of two new PCI cards.

Pickering Interfaces Ltd.

Military-Grade, Mission-Critical VPG Resistors Released by New Yorker Electronics

Industry News | 2020-11-25 13:12:15.0

VPG Foil Resistors new Model 303337 Ultra-High Precision Military- and Space-Grade Resistor One of the Industry's Most Precise and Stable Precision Resistors

New Yorker Electronics

Time & Money Saved with New 'HD' Stencil Material

Industry News | 2002-07-23 03:19:20.0

Datum Alloys (suppliers of specialist alloys) Has Found The Solution To High Density & Ball Grid Array Stencils

Datum Alloys Ltd

Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs

Industry News | 2009-12-22 10:09:22.0

Pressurex® Sensor Film Needed to Measure Contact Pressure Variations Across Flip Chip Dies and Bonding Tools

Sensor Products Inc.

Christopher Associates Debuts Koki SB6N58-A730 Low-Temperature Lead-Free Solder Paste

Industry News | 2010-12-07 15:07:35.0

Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.

Christopher Associates Inc.

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Circuit Assembly Applications

Industry News | 2012-02-22 01:32:21.0

Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.

Engineered Materials Systems, Inc.

SCS to Present Parylene Nanostructures and Coatings at IMAPS Micro/Nano-Electronics Packaging & Assembly

Industry News | 2017-04-22 11:38:03.0

Specialty Coating Systems (SCS) is pleased to announce that it will exhibit at the 2017 IMAPS Micro/Nano-Electronics Packaging and Assembly (MiNaPAD) Forum, scheduled to take place May 17-18, 2017, in Grenoble, France, at the WTC congress center. The company will exhibit its industry-leading Parylene conformal coatings and SCS Vice President of Technology Rakesh Kumar, Ph.D. will present, “Parylene Nanostructures and Coatings for Electronics Applications.”

Specialty Coating Systems

atg/LM to Launch A5-A Probe System With Automation at Productronica 2007

Industry News | 2007-11-08 21:54:57.0

atg Luther & Maelzer GmbH announces it will launch the new A5-A Probe System with Automation in Stand 341, Hall B4 at Productronica 2007. The Productronica exhibition and conference is scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.

Everett Charles Technologies

atg/LM to Exhibit A5-A Probe System With Automation at APEX 2008

Industry News | 2008-03-19 14:54:30.0

atg Luther & Maelzer GmbH announces that it will display the A5-A Probe System with Automation with Everett Charles Technologies (ECT) in booth 1383 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008, in Las Vegas.

Everett Charles Technologies


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