Industry News | 2008-08-26 15:20:45.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, introduces SP200-AV2, a new model of its automated stencil printer SP200. The printer is an advanced version of the previous generation system and offers increased robustness, precision and ease of use.
Industry News | 2009-03-17 09:35:12.0
Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will premier SP150 screen/stencil printer In booth 2225 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2009-03-20 17:14:54.0
TORRANCE, CA � March 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit Young Jin's line of conveyors in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2009-08-10 20:22:02.0
2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.
Industry News | 2009-09-17 15:08:48.0
GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2013-03-21 09:14:58.0
EVS International, will debut the newest system in its award-winning EVS series, the new EVS 8K LFHS Lead-Free Solder Recovery System, in distributor SMA Technologies’ Booth # L70 at the upcoming 27th International Electrical, Energy and Automation Industry Fair (FIEE), scheduled to take place April 1-5, 2013, at the Anhembi Exhibition Centre, in Sao Paulo, Brazil.
Industry News | 2013-03-27 16:51:17.0
EVS International, will debut the newest system in its award-winning EVS series, the new EVS 8K LFHS Lead-Free Solder Recovery System, in distributor SMA Technologies’ Booth # L70 at the upcoming 27th International Electrical, Energy and Automation Industry Fair (FIEE)
Industry News | 2013-06-20 19:31:51.0
Tresky, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.
Industry News | 2016-03-24 21:18:44.0
Techcon Systems will exhibit in Booth #B-1E52 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.
Industry News | 2017-10-10 19:41:52.0
Transition Automation announces the launch of the revolutionary PrinTEK AP-3624-V advanced benchtop large-area stencil printer. The new PrinTEK AP-3624-V boasts a 32” x 24”print area (813mm x 610mm), a load-unload-reload repeatability of better than +/- 1mil (0.001”), and can be equipped with a with a Vision option for very high precision setup. The printer itself weighs less than 500lbs. (226Kg) due to the smart use of lightweight composite materials in its design.
