Industry News | 2016-11-21 17:14:10.0
Aegis Software today announced a structural expansion to its operations in the Americas to support the rapid increase in its large-scale MES system installations as well as scaling of the global organization. With the appointment of Brian Backenstose as the Managing Director of Aegis Americas, Aegis now has parallel management and organizational structures in each of its three divisions of the Americas, Europe and Asia. Beyond improvements to corporate scaling to meet demand, this new structure enables efficient cross-divisional engineering and customer services coordination.
Industry News | 2014-09-18 18:22:57.0
FCT Assembly introduces the A-Laser Division’s new laser direct structuring (LDS) capability. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design, enhancing product capability and often at a significant cost savings.
Industry News | 2021-09-02 05:46:58.0
The Assembly Division of MacDermid Alpha Electronics Solutions will present the paper "Solder Paste for Interconnecting Structured Ribbons on the Back Side of the c-Si Cells" at the upcoming virtual European PV Solar Energy Conference and Exhibition which takes place from the 6th-10th September 2021.
Industry News | 2009-03-20 17:14:54.0
TORRANCE, CA � March 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will exhibit Young Jin's line of conveyors in booth 1035 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Industry News | 2010-12-07 15:07:35.0
Christopher Associates announced today the introduction of Koki’s SB6N58-A730 Low Temperature Lead-Free Solder Paste. SB6N58-A730 paste has a melting point of 201-210°C. The paste also demonstrates extremely high thermal shock durability.
Industry News | 2014-11-25 17:00:13.0
FCT Assembly announces that the A-Laser Division will discuss its new laser direct structuring (LDS) capability in Booth #235 at the BIOMEDevice Show, scheduled to take place December 3-4, 2014 at the San Jose Convention Center in California. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design and enhancing product capability.
Industry News | 2021-10-07 15:57:22.0
MacDermid Alpha Electronics Solutions will present 'Electronic Materials for Smart, Functional and 3D Automotive HMI Structures' at the Smart Automotive Surfaces Conference on October 7th, in Novi, Michigan USA.
Industry News | 2001-02-01 09:06:13.0
Ephraim Suhir, Ph.D., Distinguished Member of Research Staff, Bell Laboratories, Basic Research, Physical Sciences and Engineering Research Division will present a course entitled, " Fiberoptics Interconnects: Design For Reliability" in the dEsign Expo Conference at EtroniX 2001.
Industry News | 2002-05-13 08:43:26.0
Microscopic Cage that Traps Heat and Light that Would Normally Escape from a System and Transforms It into Usable Energy