Industry News: structured (Page 33 of 84)

Günter Schindler new COO of the SIPLACE team

Industry News | 2010-11-08 23:01:06.0

To complete the wide-ranging SIPLACE Excellence restructuring program and prepare for the planned transfer of SIPLACE’s ownership from Siemens AG to ASM Pacific Technology, SIPLACE Head of Development Günter Schindler has been appointed Chief Operating Officer (COO) of the global SIPLACE team effective October 1, 2010.

ASM Assembly Systems GmbH & Co. KG

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Industry News | 2010-12-03 22:31:01.0

Endicott Interconnect Technologies, Inc. (EI) announced today that the Company has added Liquid Crystal Polymer (LCP) Laminates to its family of microelectronics packaging product offerings.

i3 Electronics

Inovar to Focus on Its Services at MD&M West 2011

Industry News | 2011-01-14 13:30:29.0

Inovar Inc. announces that it will have representatives available in Booth #1592 to discuss the company’s high-quality electronics manufacturing services (EMS) at the upcoming Medical Design & Manufacturing West conference and exposition, scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.

Inovar, Inc.

Inovar to Exhibit as a Value-Added Manufacturer at the 2011 Iridium Partner Conference

Industry News | 2011-01-18 13:37:54.0

Inovar Inc. announces that it will be highlighted as a value-added manufacturer (VAM) at the upcoming Iridium Partner Conference, scheduled to take place January 25-28, 2011 in New Orleans.

Inovar, Inc.

Nihon Superior’s Keith Sweatman to Present at TMS 2011

Industry News | 2011-03-01 16:38:55.0

Nihon Superior Co. Ltd. announces that Keith Sweatman, Senior Technical Advisor, will present a paper titled "The Stability Window and Mechanical Properties of the Interfacial Intermetallic in Lead-free Solder Joints" at the upcoming TMS 2011 Annual Meeting & Exhibition.

Nihon Superior Co., Ltd.

GOEPEL electronic extends BSDL Testbench to Multi Chip Modules and 3D Chips

Industry News | 2011-03-09 20:27:49.0

GOEPEL electronic, world-class vendor of JTAG/Boundary Scan solutions announces the availability of a new option in its recently introduced EDA software TAPChecker™. Multi-Chip Modules (MCM) and 3D chips are now supported, allowing testbench generation for VHDL, Verilog and STIL output formats.

GOEPEL Electronic

ACD Offers Offshore Manufacturing Services

Industry News | 2011-06-01 23:19:11.0

Automated Circuit Design (ACD), a leading supplier to the electronics industry, now offers offshore manufacturing services.

Automated Circuit Design (ACD)

Inovar Joins the Coalition Against Counterfeiting and Piracy

Industry News | 2011-06-24 18:34:22.0

Inovar is now registered with the Coalition Against Counterfeiting and Piracy (CACP).

Inovar, Inc.

The Balver Zinn Group and Cobar Europe BV Accept a 2011 Global Technology Award for Its New SCAN-Ge071-XF3+ Solder Paste

Industry News | 2011-11-20 13:48:27.0

The Balver Zinn Group and Cobar Europe BV announces that it has been awarded a Global Technology Award in the Flux Materials category for its SCAN-Ge071-XF3+ solder paste.

Balver Zinn

Inovar to Exhibit at MD&M Texas 2012

Industry News | 2012-03-08 21:22:40.0

Inovar will exhibit in Booth #533 at the Medical Design & Manufacturing Texas Exposition. Representatives will be available to discuss the company’s high-quality electronics manufacturing services (EMS).

Inovar, Inc.


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