Industry News | 2003-05-02 08:40:42.0
EDA geometry translation software paves way for accurate analysis of complex PCBs
Industry News | 2004-02-04 15:43:08.0
Citing its successful customer service relationship between the two companies, Samsung Techwin, formerly Samsung Aerospace, has given Dynatech International exclusive North American sales and service responsibilities for Samsung Techwin's SMT pick-and-place equipment. Dynatech International formed Dynatech Technology Corp. to handle the role. The companies developed their relationship in Dynatech's servicing of Samsung Techwin's mission-critical customers in the aerospace industries.
Industry News | 2004-02-04 16:11:55.0
Dynatech Technology has enhanced its 24/7 service line with a 30-minute call-back commitment for the manufacturer's chip mounters. The new service covers models CP 20 through CP60L. The new service is available through the company's business telephone line, 215-675-3566.
Industry News | 2006-10-17 11:50:48.0
ENDICOTT, NY
Industry News | 2007-02-14 15:40:22.0
New ThermaSim Is First Online Simulation Tool to Use Finite Element Analysis Models for Increased Accuracy
Industry News | 2007-02-14 16:54:50.0
Devices Offer Twice the Voltage Breakdown of Standard Capacitors, Feature Voltage Ratings From 1000 VDC to 1500 VDC
Industry News | 2007-12-05 23:47:40.0
SANTA CLARA, Calif., Dec. 3, 2007 -- Agilent Technologies Inc. (NYSE: A) and Multiprobe Inc. today announced their intent to expand the companies' strategic partnership. As a result, Multiprobe's Multiscan Atomic Force Prober (AFP), the world's highest-resolution nanoprober, will be sold and supported by Agilent to customers in Asia and Japan.
Industry News | 2008-03-05 15:09:31.0
Latest AOI platform and tools will also make their debut at the show. Be sure to visit Agilent at Booth #1735, APEX 2008, April 1-3, Mandalay Bay Resort and Convention Center, Las Vegas.
Industry News | 2008-03-20 15:46:19.0
Essemtec will display SP200-AV, a fine-pitch printer with automatic vision adjustment, in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
