Industry News | 2016-08-23 16:25:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2022-01-14 17:06:40.0
Expanded technical conference award categories include NextGen and Student Research
Industry News | 2022-10-13 07:44:15.0
I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates
Industry News | 2013-10-21 16:05:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards at IPC’s Fall Standards Development Committee Meetings last week in Fort Worth, Texas.
Industry News | 2014-03-28 09:54:48.0
IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at Mandalay Bay Convention Center in Las Vegas.
Industry News | 2010-07-10 08:39:05.0
BEST Partners with MRC to bring customers SMT Metal Stencils
Industry News | 2010-07-10 08:36:16.0
Partners with MRC to bring high quality stencils quickly and with an accent on service
Industry News | 2022-10-04 11:23:40.0
MacDermid Alpha Electronics Solutions will present the technical paper 'Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces' at the TechBlick Conference and Expo taking place October 12-13 in Eindhoven, Netherlands.
Industry News | 2008-08-01 00:56:43.0
Agilent Technologies Inc. (NYSE: A) today announced that its N9201A Array Structure Parametric Test Solution won the Semiconductor International 2008 Editor's Choice Best Product Award for excellence in semiconductor manufacturing. The Editor's Choice Best Product Award recognizes proven products that have been acknowledged by users for providing superior performance and capabilities in semiconductor manufacturing.
Industry News | 2016-11-21 17:14:10.0
Aegis Software today announced a structural expansion to its operations in the Americas to support the rapid increase in its large-scale MES system installations as well as scaling of the global organization. With the appointment of Brian Backenstose as the Managing Director of Aegis Americas, Aegis now has parallel management and organizational structures in each of its three divisions of the Americas, Europe and Asia. Beyond improvements to corporate scaling to meet demand, this new structure enables efficient cross-divisional engineering and customer services coordination.
