Industry News | 2014-07-10 21:52:16.0
ADLINK Technology today announced the VPX6000, a rugged 6U VPX blade featuring a dual processor design based on quad-core 4th generation Intel® Core™ i7-4700EQ processors. The VPX6000 is a high performance blade designed to meet MIL-STD-810F, for harsh environments and provide the high-availability required for mission critical applications, including radar, sonar, UAV and UGV in defense and aerospace.
Industry News | 2018-05-25 11:18:48.0
SLR-434M is a 434MHz embedded transceiver for reliable long-range industrial control applications due its built-in LoRa protocol
Industry News | 2001-08-01 16:12:28.0
PCI bus-based Machine Vision Board Provides High Performance
Industry News | 2008-08-26 17:36:37.0
Richardson, TX (August 26, 2008) ASSET� InterTech (www.asset-intertech.com), the leading supplier of open tools for embedded instrumentation, recently became a founding member of the International Electronics Manufacturing Initiative's (iNEMI) boundary scan adoption project. iNEMI, which is an electronics industry consortium of over 70 manufacturers, suppliers and related organizations, has undertaken an effort to encourage greater adoption of the IEEE 1149.1 boundary scan standard (commonly known as JTAG, after the Joint Test Action Group which defined the original specification).
Industry News | 2015-10-18 19:48:29.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced the availability of the Mentor® Automotive Safety Certifiable Digital Instrument Cluster solution enabling safety-critical driver information to be displayed simultaneously with rich 3D graphics on a single instrument cluster display. The software architecture is implemented on a multi-core and even on single-core System-on-Chip, and features very fast boot time. This new solution addresses a key problem for the automotive OEMs: How to migrate safety-critical driver information to full-featured, graphically-rich digital instrument clusters and comply with safety standards including ISO 26262, without pushing up hardware or safety certification costs.
Industry News | 2022-04-28 14:33:02.0
Indium Corporation® Principal Engineer and Manager for Thermal Interface Materials Applications Andy Mackie, Ph.D., MSc, will share his technical expertise and insight on solder thermal interface material (TIM) processes at Electronic Components and Technology Conference (ECTC) taking place May 31-June 3, in San Diego, Calif., U.S.
Industry News | 2019-05-31 08:50:57.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Industry News | 2019-05-31 08:56:07.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Industry News | 2001-08-01 16:17:49.0
Frame Grabber Provides Special Features for Line Scan Applications
Industry News | 2001-08-01 16:27:32.0
Frame Grabber Provides Special Features for Line Scan Applications
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