Industry News | 2014-09-18 17:55:32.0
SMTA China announcing that it presented awards for nine papers at the SMTA China South 2014 Conference Award Presentation Ceremony, held on Tuesday, August 26, 2014 at Shenzhen Convention & Exhibition Center in conjunction with the SMTA China Annual Award Ceremony.
Industry News | 2014-03-20 14:21:26.0
COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.
Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
Industry News | 2021-08-28 04:15:29.0
Shrinking stencil apertures and gaps between padshave necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on finefeature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.
Industry News | 2010-09-14 17:17:30.0
Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test and production solutions, introduces its ThermoScan™ test technology. The ThermoScan™ sensor can be installed on a flying probe shuttle for general application or a probe module with Z-movement for more accurate measurement over the integrated circuits (ICs).
Industry News | 2005-07-11 12:52:53.0
Parvus now offers low-power Intel Pentium III-based architecture in three new ruggedized PC/104-Plus CPU boards, the SpacePC 1460, 1461 and 1463
Industry News | 2008-03-20 16:08:23.0
LITTLETON, MASS. - VJ Electronix, the leader in X-Ray inspection technology and Rework systems, announces that it will exhibit the Summit 1800A advanced rework system in booth 648 at the upcoming IPC APEX exhibition and designers summit, scheduled to take place April 1-3, 2008, in Las Vegas, NV
Industry News | 2022-01-10 16:28:20.0
Once again, customers looking for leading-edge test solutions can come to Seica's booth 1100 and view the future of Flying Probe test in the form of the new PILOT VX platform. Fast, Powerful and Smart: the Pilot VX raises the bar of flying probe test performance, with cutting-edge solutions that address the fundamental concerns of electronic board manufacturers looking to optimize their investment.
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