Industry News: support pins (Page 17 of 49)

Everett Charles Technologies’ CPG to Introduce the New Edge™ in Loaded Board Test at the IPC APEX EXPO

Industry News | 2011-03-10 21:52:11.0

The Contact Products Group (CPG) of Everett Charles Technologies will display the Edge™ for the first time in Booth #447 at the upcoming IPC APEX EXPO. The Edge™ provides an economical, sharp, aggressive and shallow angle blade tip for reliable via probing on PCBs by incorporating ECT’s patented ZIP® flat technology manufacturing cost advantages.

Everett Charles Technologies

Everett Charles Technologies’ CPG to Showcase the New Edge™ in Loaded Board Test at the Del Mar Electronics & Design Show

Industry News | 2011-04-07 01:26:00.0

The Contact Products Group (CPG) of Everett Charles Technologies will showcase the Edge™ in Booth #721 at the upcoming Del Mar Electronics and Design Show, scheduled to take place May 4-5, 2011 at the Del Mar Fairgrounds in San Diego, CA.

Everett Charles Technologies

Multitest MT9510 Pick-and-Place Handler Meets the Requirements of ICs for Connectivity and Cloud Servers

Industry News | 2013-08-22 11:29:24.0

Multitest announces that due to mobility and the related demand for connectivity, the data volume in cloud servers is significantly growing.

Multitest Elektronische Systeme GmbH

CableEye® HiPot Cable & Harness Test System, HVX-21

Industry News | 2015-08-05 14:30:53.0

CAMI Research announces an addition to its CableEye cable and harness testing system suite, specifically to the HV product line. The HVX-21 extends the HiPot test voltage range to 2100 Vdc and 1200 Vac permitting detection of even more subtle defects.

CAMI Research Inc.

Press preview for Seica for SMTA Show Rosemont IL

Industry News | 2019-08-27 23:44:30.0

Seica will be exhibiting at the Rosemont, IL Conference and Convention Center on September 24-25 in booth 415. On exhibition will be Seica's new desktop Dragonfly AOI inspection system, which utilizes leading-edge LED technology to perform conformal coat and through-hole-technology inspection, including presence checks of pins and solder, effectively combining two distinct inspection processes in a single machine.

SEICA SpA

Multitest’s Solution for 3D Packages Released to Production Electrical test during the assembly process ensures best production yield

Industry News | 2012-07-09 08:11:26.0

Multitest announces that the first Multitest Plug & Yield solution for the test of 3D packages recently has been released to the customer’s production.

Multitest Elektronische Systeme GmbH

Catalyst Semiconductor 128-Bit EEPROM Reduces PCB Area by 40 Percent

Industry News | 2003-04-29 08:44:42.0

New technology allows the CAT24C00 to be packaged in a compact, 5-pin SOT23 package that requires 40 percent less printed circuit board area than an MSOP package.

Catalyst Semiconductor

Everett Charles Technologies to Attend BiTS Socket Workshop 2009

Industry News | 2009-03-06 14:54:52.0

Everett Charles Technologies will display advanced technologies in booth A44 at the upcoming Bits BGA Socket Workshop, scheduled to take place March 8-11, 2009 at the Hilton Phoenix East/Mesa Hotel Mesa in Arizona.

Everett Charles Technologies

FCT Assembly Solves Bridging Issues at Reflow

Industry News | 2012-04-09 13:45:59.0

As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.

FCT ASSEMBLY, INC.


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