Industry News: support pins (Page 31 of 49)

JEDEC Announces Key Attributes of Upcoming DDR4 Standard

Industry News | 2011-08-24 13:05:21.0

JEDEC Solid State Technology Association announced selected key attributes of its widely-anticipated DDR4 (Double Data Rate 4) standard.

JEDEC Solid State Technology Association

Javad EMS Adds Large Board Line

Industry News | 2014-12-20 10:49:39.0

avad EMS (JEMS)announces that it has added a large board line to continue meeting customer needs. With the use of HDI printed circuit boards, more densely populated boards using high pin count BGAs, QFNs and LGAs, micro BGAs, and smaller and smaller devices including 10005s, it seems that assemblies should be getting smaller in size. However, in some cases it is the inverse: printed circuit boards are getting larger. This has prompted JEMS to make a sizeable investment to provide large board capability to customers. With a planned expenditure and installation of more than $1.45 million in Q3/14, the company will have the capability of handling boards that are up to 22x26" in an in-line manufacturing process to complement its three other existing Juki surface mount lines.

Javad EMS

Preview for Seica SMT Nuremberg May 16-18, 2017 Booth # 4A-300. In the limelight: Industrial Monitoring and Automation

Industry News | 2017-05-05 12:26:30.0

Seica will be showcasing the new Factory DashBoard solution at the SMT exhibition. The solution has been conceived with a special focus towards energy saving requirements and predictive monitoring of events, in compliance with the principles of Industry 4.0. All systems on the booth will integrate Seica's industrial monitoring hardware, and visitors will be able to see the software and mobile tools that provide 'real time' information to assist plant managers in assessing the status of all the equipment in the plant.

SEICA SpA

Preview for productronica 2017 JTAG Visualizer Update Adds Features for Faster Debug

Industry News | 2017-11-07 17:54:38.0

JTAG Technologies is excited to announce the latest version of its acclaimed Visualizer graphical viewing tool for board (PCB) layouts and schematics. Allowing users to assess fault coverage data and pin-point production test faults in a snap.

JTAG Technologies B. V.

Koh Young SPI Dispenses Solder Paste for 0402M (01005) Microchips

Industry News | 2018-09-04 10:25:16.0

Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.

Koh Young America, Inc.

JTAG Technologies Targets Functional Testers at Autotest 2014, St. Louis, Booth 727

Industry News | 2014-09-17 10:42:30.0

JTAG Technologies is showcasing amongst other products the new JTAG/boundary-scan hardware interface product compatible with the Virginia Panel (VPC) mass interconnect system.

JTAG Technologies B. V.

Panasonic Factory Solutions Moves To New Facilities

Industry News | 2010-09-14 13:14:42.0

Panasonic Factory Solutions Company of America has moved into a new dedicated demonstration and training facility in Buffalo Grove, IL and offices in nearby Rolling Meadows, IL.

Panasonic Factory Solutions Company of America (PFSA)

BPM Microsystems to Debut New Solution for In-System Device Programming at the 2012 IPC APEX Expo

Industry News | 2012-02-03 12:58:42.0

BPM Microsystems will debut its new production solution for in-system device programming in Booth #3702 at the upcoming IPC APEX Expo.

BPM Microsystems, Inc.

BPM Microsystems to Demonstrate New Solution for In-System Device Programming at the 2012 SMT Hybrid Packaging Exhibition

Industry News | 2012-04-27 13:44:41.0

BPM Microsystems will demonstrate its new in-system device programming solution in Hall 7, Stand 648 at the upcoming SMT Hybrid Packaging Exhibition, scheduled to take place May 8 - 10, 2012 at the Exhibition Centre Nuremberg in Germany.

BPM Microsystems, Inc.


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