Industry News: switching from tin lead (Page 1 of 84)

Tin Whisker Joint Meeting Held in Tokyo

Industry News | 2003-06-23 08:49:39.0

Three Organizations from the US, Europe and Japan to

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Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

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Matsushita Electric (Panasonic) Completes Switch to Lead-Free Solder Used for Printed Circuit Boards

Industry News | 2003-05-28 08:20:13.0

Aiming to promote its environmental activities on a global basis, the use of lead-free solder conforms to the European Union's regulation on restrictive use of toxic substances.

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Water-Based Flux Line Covers Full Range of Applications

Industry News | 2003-02-17 08:40:25.0

To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements

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For Electronics, Phoenix Contact has Professional Housings

Industry News | 2003-06-03 08:20:48.0

Designed for fast and easy DIN-rail mounting

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Camden Electronics Appoints New Distributor in Germany for Enclosure Products

Industry News | 2003-06-09 09:41:14.0

Mehlo Bauelemente GmbH specialises in electronic packaging and has 20 years experience serving the German market with a wide range of enclosure products.

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Optical MEMS Finding Greater Opportunities in Non-Telecom Products

Industry News | 2003-07-02 09:35:30.0

As a result, sales of optical MEMS, into segments other than telecommunications, are forecast to grow at a CAGR of 15.8% over the next five years.

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Electronics Workbench Announces Multisim 7 and Multicap 7 for Professional Circuit Engineers and Designers

Industry News | 2003-05-06 09:05:12.0

New Schematic Capture and Simulation Software Delivers Innovative Features and the Industry�s Best Price/Performance

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InDigiNet To Acquire 2.5million in Assets

Industry News | 2003-05-08 07:11:45.0

InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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