Industry News: tackiness (Page 6 of 8)

Kester to Exhibit at SMT Hybrid Packaging 2017

Industry News | 2017-04-04 17:11:23.0

Kester will be exhibiting (booth # 4-533), at SMT Hybrid Packaging 2017, which will take place May 16-18 at the Exhibition Centre in Nuremberg, Germany.

Kester

Kester to Exhibit and Present at IPC APEX Expo 2017

Industry News | 2017-01-17 17:50:29.0

Kester will be exhibiting (booth #2205) at IPC APEX Expo 2017, which will take place February 14-16 at the San Diego Convention Center. Kester’s booth will offer attendees the opportunity to meet with the R&D and sales teams, and learn more about Kester’s new products.

Kester

Indium Corporation to Present at MiniLED Seminar

Industry News | 2022-07-31 19:30:38.0

Indium Corporation's Anson Yu, regional sales manager for Eastern and Northern China, will present on the company's diverse portfolio of soldering solutions for the MiniLED market at the Mini LED Backlight Mass Production and Application Trend Conference, Thursday, July 28 in Shenzhen, China.

Indium Corporation

Kester Wins Circuit Assembly’s 2017 NPI Award

Industry News | 2017-02-28 12:28:23.0

Kester was awarded Circuit Assembly’s 2017 New Product Introduction (NPI) Award in the category of Flux for SELECT-10™ Selective Solder Flux. The award was presented during the IPC APEX EXPO 2017.

Kester

Kester Launches WP601-ZH Solder Paste

Industry News | 2017-03-13 10:58:51.0

Kester is proud to announce the launch of WP601-ZH, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP601-ZH is a breakthrough in water-soluble solder paste technology, providing a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation.

Kester

Kyzen to Feature MICRONOX® MX2302 at IWLPC 2009

Industry News | 2009-09-28 15:55:11.0

NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will feature MICRONOX® MX2302 wafer-level cleaning solution at the upcoming International Wafer-Level Packaging Conference and Tabletop Exhibition, scheduled to take place October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, CA.

KYZEN Corporation

Kyzen to Feature MICRONOX® MX2302 at IMAPS 2009

Industry News | 2009-10-09 23:00:07.0

NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will feature MICRONOX® MX2302 wafer-level cleaning solution in booth 1022 at the upcoming IMAPS 42nd International Symposium on Microelectronics, scheduled to take place November 3-5, 2009 at the San Jose Convention Center in San Jose, CA.

KYZEN Corporation

The Balver Zinn Group Sponsors IPC Hand Soldering Competition at Productronica

Industry News | 2013-10-09 09:50:45.0

The Balver Zinn Group today announced that it will sponsor the IPC hand soldering competition at Productronica, scheduled to take place November 12-15, 2013 at the New Munich Trade Fair Centre in Munich, Germany.

Balver Zinn

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

Kester to Exhibit at SMT Hybrid Packaging 2016

Industry News | 2016-04-18 11:30:07.0

Kester will be represented through our German sales partners, ADL Prozesstechnik UG (booth # 7-426) and EURO TOOL GmbH (booth # 7-520), at SMT Hybrid Packaging 2016, which will take place April 26-28 at the Exhibition Centre in Nuremberg, Germany.

Kester


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