Industry News: tackiness (Page 7 of 8)

Kester to Exhibit and Present at SMTA China East 2016 Technology Conference & NEPCON China

Industry News | 2016-04-18 11:31:46.0

Kester will be exhibiting together with Speedline and Vitronic Soltec (booth # 1G40, Hall 1) at SMTA China East Conference 2016 which will be held in conjunction with NEPCON China 2016 in Shanghai on April 26-28.

Kester

Kester to Exhibit and Present at SMTA International 2016

Industry News | 2016-09-08 17:26:45.0

Kester will be exhibiting (booth #500) at Surface Mount Technology Association International (SMTAI) 2016, which will take place September 27-28 at the Donald Stephens Convention Center in Rosemont, IL.

Kester

Low Temperature Soldering Workshops and Training Materials

Industry News | 2019-09-03 12:08:08.0

With the growing interest in the use of low temperature soldering and the use of solder paste in rework we have created the first training resources available to downoad at www.bobwillis.co.uk Training materials for use in your own onsite workshops or tailor made onsite hands on sessions. The training material feature training wall charts and a photo album of images to use in PowerPoint, reports or on websites

ASKbobwillis.com

Breakthrough Epoxy Flux Technology from Henkel Offers Cost-Effective Single Material Solution for Advanced Package Configurations

Industry News | 2008-04-17 16:46:07.0

In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol� FF6000�, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress.

Henkel Electronic Materials

Kester to Exhibit Leading Fluxes, Pastes and Wires at SMTA Atlanta

Industry News | 2009-04-13 16:23:27.0

ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.

Kester

Kyzen to Showcase Advanced Cleaning Chemistries at NEPCON West China 2010

Industry News | 2010-06-01 14:33:37.0

NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will showcase AQUANOX® A4703, AQUANOX® A4625B and IONOX® I3302 in booth F1 at the upcoming NEPCON West China 2010, scheduled to take place June 22~24 in Chengdu, PR China.

KYZEN Corporation

Kyzen to Showcase Advanced Cleaning Chemistries at NEPCON West China 2010

Industry News | 2010-06-04 17:09:38.0

NASHVILLE — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that it will showcase AQUANOX® A4703, AQUANOX® A4625B and IONOX® I3302 in booth F1 at the upcoming NEPCON West China 2010, scheduled to take place June 22~24 in Chengdu, PR China.

KYZEN Corporation

See Eco-Friendly Advanced Electronics Cleaning Solutions by Kyzen at NEPCON South China 2010

Industry News | 2010-08-02 13:42:52.0

Kyzen, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, will exhibit its products for any process including AQUANOX® A4703, AQUANOX® A4625B and IONOX® I3302 in booth 2F10 at the upcoming NEPCON South China 2010 exhibition and conference. The event is scheduled to take place August 31- September 2, 2010 at the Shenzhen Convention & Exhibition Centre.

KYZEN Corporation

Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO

Industry News | 2013-01-16 08:45:06.0

Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.

Nihon Superior Co., Ltd.

AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373).

Industry News | 2014-03-20 14:21:26.0

COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.

AI Technology, Inc. (AIT)


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