Industry News: take-up (Page 1 of 6)

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

SMTnet

SMTA INTERNATIONAL FT WORTH

Industry News | 2011-11-03 21:52:00.0

By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.

SMTnet

Singulating Pre-Scored PCB Panels up to 48”Long

Industry News | 2017-07-18 13:16:28.0

Depanelizing skip routed PCB panels up to 48" long is made simple and easy with FKN Systek’s K4000 PCB singulator. Just place the bottom scoreline of the PCB onto the linear blade and step on a guarded foot switch to bring the circular blade across the top scoreline for clean separation of the PCB panels. Right and left blade guards assure operator safety. The front and back support and take up table are height adjustable.

FKN Systek

Precision PCB Services, Inc. introduces Nitrogen Capable BGA Rework Station

Industry News | 2017-05-19 13:34:13.0

Precision PCB Services is pleased to announce the addition of a Nitrogen capable BGA Rework Station to their product line.

Precision PCB Services, Inc

The Future of Embedded Passive Components

Industry News | 2018-10-18 10:28:01.0

The Future of Embedded Passive Components

Flason Electronic Co.,limited

Search for New IPC President and CEO Begins

Industry News | 2011-10-08 17:54:35.0

IPC is seeking an outstanding individual to become its next president and chief executive officer (CEO). The candidate will succeed current CEO Denny McGuirk, who leaves on November 3 to become president of SEMI, the global industry association serving the nano- and microelectronics manufacturing supply chains.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

New feeder technology reduces changeovers by 75%

Industry News | 2001-11-14 10:56:35.0

MYDATA automation announces its latest innovation in surface mount technology - a feeder that tests show reduces setup and changeover times by 75 percent.

Mycronic AB

Reed Relay with the world’s smallest footprint to be unveiled at Semicon West

Industry News | 2017-06-29 17:52:43.0

Pickering Electronics plan to release exciting new Reed Relay, the Series 120, at Semicon West 2017, on booth 5162. The Pickering Series 120 is a range of Single Pole (1 Form A) reed relays that will require a board area of only 4mm x 4mm, making it the highest packing density currently available, taking up the smallest board area ever.

Pickering Electronics

Valor, Syncron Offer First Automated Footprint Generation

Industry News | 2002-04-10 08:28:53.0

Combined Package Offers �a Substantial Improvement in Quality and Speed� of CAD Library Management

Valor Computerized Systems

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