Industry News: taking (Page 12 of 582)

Third Session of the High-Rel Cleaning & Conformal Coating Conference to Focus on Conformal Coating for Class 2 and 3 Electronic Assemblies

Industry News | 2016-09-29 20:17:32.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Association Connecting Electronics Industries (IPC)

Session 4 of IPC & SMTA's Conference to Focus on Ultra-Thin or Nanocoatings

Industry News | 2016-10-20 19:46:11.0

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

Association Connecting Electronics Industries (IPC)

SMTA Announces Technical Program for International Conference for Electronics Hardware Enabling Technologies (ICEHET)

Industry News | 2022-05-05 17:16:31.0

The SMTA is pleased to announce the finalized technical program for the International Conference for Electronics Hardware Enabling Technologies. The in-person conference will take place June 14 - 15, 2022 at the Centennial College Event Centre in Toronto, Ontario, Canada.

Surface Mount Technology Association (SMTA)

IPC Hand Soldering Competition Winner Crowned at ELECTROSUB 2017 in Budapest

Industry News | 2017-10-26 16:24:30.0

IPC, in conjunction with ELECTROSUB 2017, conducted the IPC Hand Soldering Competition at ELECTROSUB 2017 in Budapest, Hungary. The competition in Budapest drew the highest number of professional hand soldering competitors to date in Europe of 51. Unique to ELECTROSUB 2017 was an IPC HSC competition for high school students. The 16 high school competitors were not going to be out done by their older professional competitors as they put their best soldering techniques on display vying for cash prizes for first, second and third place. Taking first place in the high school competition with a cash prize of €30 was Mate Toth, Technical High School, Komarno, Slovakia. In second place with a cash prize of €20 went to Bence Marki, Palfy Water Management Technical High School, Szolnok, Hungary. Taking third place with a cash prize of €10 was Gilles Cumin, from Lajos Bardos Elementary School, Lagymanyos, Budapest, Hungary.

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO 2016 Educational Programs Highlight Research, Innovation and Forward Thinking Registration Now Open

Industry News | 2015-12-16 18:38:46.0

The latest technical research, industry best practices, ground-breaking technologies and forward thinking innovations will take center stage throughout the IPC APEX EXPO® 2016 technical conference and professional development courses, which will take place March 13–17 at the Las Vegas Convention Center in Las Vegas, Nevada. Registration is now open at www.IPCAPEXEXPO.org.

Association Connecting Electronics Industries (IPC)

Turn Inspiration into Innovation through IPC APEX EXPO 2017 Educational Programs

Industry News | 2016-11-15 18:05:05.0

The latest technical research, industry best practices, trending topics, ground-breaking technologies and forward thinking innovations will take center stage throughout the IPC APEX EXPO® 2017 technical conference and professional development courses, which will take place February 11–16 at the San Diego Convention Center in San Diego, California. Registration is now open at www.IPCAPEXEXPO.org.

Association Connecting Electronics Industries (IPC)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

Session 6 Agenda Is Finalized for the High-Rel Cleaning and Coating Conference Hosted by IPC and SMTA

Industry News | 2012-11-07 11:01:55.0

IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.

Association Connecting Electronics Industries (IPC)

Technical Papers Take Top Honors at IPC APEX EXPO Winning Papers to be Presented at Technical Conference

Industry News | 2013-02-14 08:18:47.0

IPC – Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2013

Association Connecting Electronics Industries (IPC)

IPC APEX EXPO 2015 Programs Highlight Technology and Innovation Registration Now Open

Industry News | 2014-11-17 18:24:17.0

IPC APEX EXPO 2015 technical conference and professional development sessions, which will take place February 22-26 at the San Diego Convention Center in San Diego, California. Registration is now open at www.IPCAPEXEXPO.org.

Association Connecting Electronics Industries (IPC)


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