Industry News | 2019-11-20 13:43:25.0
20 November 2019 – Duluth, GA – At a ceremony during Productronica in Munich Germany, Mr. Harald Eppinger, Managing Director at Koh Young Europe proudly accepted the Global Technology Award for the Koh Young KY-P3 M3 pin and terminal automated inspection solution.
Industry News | 2021-06-30 04:19:07.0
Flying Probe Testing is an integral part of Printed Circuit Board Assembly (PCBA) at BSU Inc., ensuring that the correct electronic components are properly positioned and operating correctly on customers' assembled electronic products. Such testing ensures the robust reliability and quality of each PCBA assembled, states Ahmad Chamseddine, President. BSU Inc. is a growing EMS company centrally located in Austin, Texas.
Industry News | 2023-01-30 15:54:20.0
Scienscope International received a 2023 CIRCUITS ASSEMBLY NPI Award in the category of Automation Tools for its AXI-5100c III Component Counting System with automatic loader, printer and conveyor. The award was announced in San Diego during a ceremony on Monday, Jan. 23, 2023.
Industry News | 2024-03-18 11:33:41.0
Hanwha Techwin Automation Americas will exhibit at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Under the theme "All you need in productivity is here at Hanwha," Hanwha invites attendees to explore its range of state-of-the-art solutions, including the XM520, HM520W, HM520, Decan S1 and ESE Stencil Printer Technology. Renowned for delivering best-in-class performance, these solutions promise to redefine efficiency, accuracy, and productivity in the world of electronics manufacturing.
Industry News | 2024-05-13 10:01:55.0
Europlacer is excited to highlight the success of its latest premium stencil printer, the ii-P7, showcased at the recent 2024 IPC APEX EXPO. Boasting groundbreaking features and productivity enhancements, the ii-P7 has set a new standard in precision and efficiency for high-mix assembly environments.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
Industry News | 2005-02-17 09:43:45.0
STOCKHOLM, Sweden, Feb 14, 2005
Industry News | 2007-10-08 23:25:30.0
ESSEMTEC, a leading manufacturer of surface mount technology production equipment, announces that it will showcase several SMT production systems in distributor Torenko & Associates� booth at the upcoming Mexitr�nica exhibition, scheduled to take place October 23-25, 2007, at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.
Industry News | 2007-10-30 00:56:03.0
Aesch/Switzerland � Essemtec AG, Switzerland, a leading manufacturer of surface mount technology production equipment, announces that it will highlight CSM7100V, a highly flexible pick-and-place system with intelligent feeders and vision for high-mix/low-volume production, in booths A5-277 and A5-278 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2008-08-18 15:20:40.0
San Diego � August 2008 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that it has expanded its presence in the European marketplace with the addition of GS Electronic Vertriebs und Service GmbH, a leading solutions provider of photovoltaic cell manufacturing, to its global distributor network. Focusing on solutions for the fast-growing photovoltaic (PV) cell manufacturing market, the company will represent KIC's new SunKIC profiler.
