Industry News | 2016-12-10 08:12:27.0
The Simulator makes it possible to test-drive TIDE and TiOS, as well as run and debug Tibbo BASIC and C applications, without having to commit to a purchase of a physical Tibbo device.
Industry News | 2020-07-29 17:51:05.0
CyberOptics® Corporation (NASDAQ: CYBE) will present at the SPIE Optics and Photonics On-Line Conference on August 24 during the SPIE Optical Engineering and Applications Symposium's verification and alignment session from 8:20 to 10:00am.
Industry News | 2009-04-13 15:02:37.0
ECD introduced its thermal quality management program, called ThQM, for OEMs and their volume manufacturers. It is designed to directly address the dialog required between OEMs and contract assemblers, including OEM requirements, machine recipe development, and thermal profile verification.
Industry News | 2009-12-07 18:26:25.0
Everett Charles Technologies (ECT) announces plans to launch its new Z pin™ test probe in booth 567, Hall 1 at the upcoming Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2010-03-26 23:28:15.0
Everett Charles Technologies announces that Gary St. Onge, Director of US and China Operations, will present a paper titled "Zoom Fixtures for ATE" at the upcoming IPC/APEX conference and exhibition.
Industry News | 2010-10-06 13:33:06.0
Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced that an independent panel of judges has named the Lattice Diamond™ design software environment a finalist in Elektra 2010, the European Electronics Industry Awards competition.
Industry News | 2011-03-09 20:27:49.0
GOEPEL electronic, world-class vendor of JTAG/Boundary Scan solutions announces the availability of a new option in its recently introduced EDA software TAPChecker™. Multi-Chip Modules (MCM) and 3D chips are now supported, allowing testbench generation for VHDL, Verilog and STIL output formats.
Industry News | 2011-04-27 20:09:26.0
Two of Indium Corporation's technology experts will present their technical findings at IMAPS New England in Boxboro, MA, May 3, 2011.
Industry News | 2011-12-27 19:59:33.0
Fuji Machine Manufacturing Co., Ltd. with supplier Toyo Communication Technology Co., Limited will establish a joint venture called KUNSHAN FUJI MACHINE MFG. CO., LTD. (provisional) in Kunshan, Jiangsu, China. This joint venture will manufacture, in China, highly reliable, high quality, cost competitive machine parts and assemblies to be used in machines such as electronics assembly machines and machine tools. In addition, there is the prospect that electronics assembly machines and machine tools will be produced locally in the future. With both companies combining their strengths such as the advanced technology from Fuji and the supply chain from Toyo in this cooperative venture, we can provide more competitive products. This joint venture will be established in April 2012 (scheduled) and our target is to begin operations during 2013.
Industry News | 2016-03-03 10:33:15.0
Indium Corporation's Sze Pei Lim, Semiconductor Product Manager for Asia, will present at SEMICON China. Lim's presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue, no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process.
