Industry News | 2009-10-31 01:40:29.0
San Diego — October 2009 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that MB (Marybeth) Allen, General Manager Operations, will present “Increase Solar Cell Efficiency With Thermal Process Optimization” at the Sustainability Summit 2009, which is scheduled to take place November 3-5, 2009 at the Milanofiori Congress Center in Milan, Italy.
Industry News | 2014-06-26 19:47:04.0
The worlds of supercapacitors and graphene are converging. That is why IDTechEx has a complete two day nine conference co-located event on these subjects, which will take place in Santa Clara, CA this November 19-20.
Industry News | 2018-02-26 10:55:21.0
Scienscope International will be featuring its new AXI-5100C automated in-line component counting system at this year’s IPC APEX EXPO. Component counting and inventory validation via X-ray analysis is an efficient process being increasingly employed within the circuit assembly world.
Industry News | 2024-03-18 12:29:00.0
Impossible Objects proudly announces plans to exhibit at Apex 2024, scheduled to take place April, 9-11, 2024 at Anaheim Convention Center. The focus of this exhibition is the game-changing CBAM-25 industrial 3D printer, a true paradigm shift in high-speed, high-performance additive manufacturing.
Industry News | 2017-04-11 21:10:41.0
Juki Automation Systems is pleased to announce that BTW Inc. recently purchased and completed the install of four KE-3010 High Speed Chip Shooters. BTW has been a valued Juki customer for more than 20 years.
Industry News | 2018-12-13 02:06:08.0
Maintain the Pick And Place Machine
Industry News | 2022-07-25 08:03:11.0
Critical cleaning experts, MicroCare LLC, has announced the launch of a new product line of Standard Presaturated IPA Wipes as an alternative for more economical surface, tool and equipment cleaning. Leveraging existing MicroCare product development and manufacturing capabilities, the new wipes deliver cleaning solutions to help manufacturers quickly get perfectly clean surfaces at the lowest cost per clean.
Industry News | 2023-10-16 12:25:59.0
Impossible Objects proudly announces plans to exhibit in Hall A3, Stand 120 at productronica 2023, scheduled to take place Nov. 14-17, 2023 at the Messe München in Munich, Germany. The focus of this exhibition is the game-changing CBAM-25 3D printer, representing a revolution in additive manufacturing technology, alongside Impossible Objects' ongoing mission to be a premier tooling supplier to the global electronics manufacturing community.
Industry News | 2013-07-22 13:11:40.0
Ryder Industries Ltd. a professional EMS provider, today announced that it has built a new wholly owned plant in China, in Xin Feng city, Jiangxi province.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
