Industry News | 2012-06-11 18:41:32.0
Opening Keynote speaker is in the hands of the electronics manufacturing industry. IPC is asking industry to decide who would be the ideal keynote speaker to kick off three days of inspiring information and knowledge at IPC APEX EXPO 2013, February 19–21, in San Diego.
Industry News | 2012-06-11 18:41:48.0
Opening Keynote speaker is in the hands of the electronics manufacturing industry. IPC is asking industry to decide who would be the ideal keynote speaker to kick off three days of inspiring information and knowledge at IPC APEX EXPO 2013, February 19–21, in San Diego.
Industry News | 2013-07-01 19:34:57.0
The decision of who will be the Opening Keynote at IPC APEX EXPO® 2014, March 25–27 in Las Vegas, is being put to a vote.
Industry News | 2009-08-20 15:26:58.0
To progress development of its next-generation pre-applied underfill materials, LORD Corporation has selected DEK’s award-winning Galaxy platform. LORD, a Cary, North Carolina-based leading manufacturer of electronic materials, found the precision, accuracy and process capability of the Galaxy simply unmatched and, therefore, the ideal system to enable its materials innovation initiatives.
Industry News | 2010-08-17 14:51:15.0
Enjoying the materials innovation success it has realized with its first DEK Galaxy system, Cary, North Carolina-based LORD Corporation recently expanded its development capacity with the addition of a second Galaxy equipped with DEK’s new Wafer Transport Solution.
Industry News | 2009-08-04 16:28:40.0
2 @ +/- 12.5µm and advanced speed and acceleration control to ensure robust processing of today’s delicate wafer products.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Industry News | 2013-09-06 15:39:36.0
PROMATION Inc. announces that the updated corporate Web Site is now mobile friendly
Industry News | 2009-08-19 13:06:06.0
Extending its capabilities for placing solder spheres at high speed, DEK’s proven DirEKt Ball Placement™ process now enables accurate solder sphere deposition for spheres as small as 200µm in diameter with pitches as tight as 300µm. With the ability to achieve this accuracy and precision at a first pass yield of over 99.99%, DirEKt Ball Placement delivers the speeds necessary for modern package manufacture without sacrificing anything in the way of performance.
Industry News | 2009-08-10 20:22:02.0
2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.
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