Industry News | 2015-11-18 18:56:31.0
The SMTA is pleased to announce its election results for the Board of Directors for the term that began at SMTA International (September 27 - October 1, 2015). Robert Kinyanjui, Ph.D., John Deere Electronic Solutions, Inc. was elected Treasurer. Eileen Hibbler, TEK Products, was elected VP Membership. Richard Coyle, Ph.D., Alcatel-Lucent, and Tim Jensen, Indium Corporation, were appointed to the Strategic Development Committee.
Industry News | 2022-09-05 07:02:13.0
The SMTA is pleased to announce its election results for the Global Board of Directors for the term beginning September 28, 2022. Martin Anselm, Ph.D., Rochester Institute of Technology was re-elected for a second term as President. Incumbents Julie Silk, Keysight Technologies and Robert Boguski, Datest Corporation, were re-elected and will maintain their positions as VP Tech Programs and VP Membership respectively. Fernando Rueda, KYZEN Corporation, and Patty Chonis, A-Tek LLC, have been newly elected to the Board of Directors.
Industry News | 2019-09-04 15:03:14.0
Nordson ASYMTEK will highlight fluid dispensing systems, applications, processes, and best practices for advanced packaging assembly at the D-Tek Technology booth #I2312-First Floor, at SEMICON Taiwan 2019, Taipei Nangang Exhibition Center, Taipei, Taiwan, September 18-20, 2019.
Industry News | 2017-07-23 20:16:25.0
The SMTA is pleased to announce its election results for the Board of Directors for the term beginning during SMTA International (September 17 - 21, 2017). Bill Capen, DRS Technologies, and Greg Vance, Rockwell Automation, were elected to the Strategic Planning Committee. Debbie Carboni, KYZEN Corporation, was re-elected as VP Expos.
Industry News | 2013-01-28 07:29:00.0
IPC APEX EXPO® debut new products and services
Industry News | 2011-11-08 15:31:27.0
The SMTA and Chip Scale Review magazine are pleased to announce the 8th Annual International Wafer-Level Packaging Conference and Exhibition was a resounding success.
Industry News | 2022-05-27 14:34:04.0
From battery fires to non-functional charging stations, from dendrites to poor cable connections, electronic system failures have caused massive recalls. Failures are increasing significantly, not because of quality, but because of usage and implementation of technology. As the expected lifetime usage of parts increases and technology applications change, materials, approaches, and test parameters must change as well.
Industry News | 2024-11-18 19:33:26.0
IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.
Industry News | 2011-09-01 20:33:47.0
Bragging rights are on the line as the First Annual IPC Midwest Soldering Competition takes place, September 21-22, in Schaumburg, Ill., to determine the Best Hand-Soldering Technician in the Midwest for 2011.
Industry News | 2014-10-23 16:23:16.0
During the 2014 Annual Meeting at SMTA International, the SMTA honored members who have shown exceptional service to the association and the electronics assembly industry.
