Industry News | 2021-03-19 06:03:18.0
BTU International, Inc. today announced that it was awarded two 2021 EM Innovation Awards during SEMICON China. The company was awarded in the categories of PCBA-SMT-Reflow-Vacuum Oven for its PYRAMAX™ Vacuum Reflow Oven, and PCBA-SMT-Reflow-Inspection System for the new Health Check Service. The awards were presented during a ceremony on March 17, 2021 at the Shanghai New International Expo Centre.
Industry News | 2021-10-28 22:06:34.0
In the past few months, we made a big upgrade for the new version of Lora soil moisture. In this article, we will introduce the great improvements on Makerfabs Lora Soil Moisture sensor V3!
Industry News | 2015-11-14 15:40:08.0
Datest announces that it was awarded a 2015 Global Technology Award in the category of Test Services for its PCBA/PCBF Reverse Engineering Service. The award was presented to the company during a Tuesday, Nov. 10, 2015 ceremony that took place at the Messe München exhibition center in Munich, Germany during productronica.
Industry News | 2016-09-26 20:00:28.0
SHENMAO America, Inc. is the American subsidiary of SHENMAO Technology, Inc. of TaoYuan City 328, Taiwan. Shenmao is a global leader of superior solder materials with 10 manufacturing, technical and sales support facilities located around the world. SHENMAO America, Inc. manufactures solder paste in San Jose, CA, U.S.A., supporting a wide range of products for the PCBA and Semiconductor Industries.
Industry News | 2021-09-24 13:31:07.0
Investments over the past 18 months support continuing technology advancements and business growth at the electronics design and contract manufacturing center near Rochester, NY
Industry News | 2015-05-13 14:00:03.0
The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.
Industry News | 2018-07-26 18:49:02.0
Circuitronics today announced that it has invested to add large-format capabilities. The company invested in Vitronic Soltec’s Delta Wave soldering system to accommodate assemblies up to 24".
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2019-01-08 20:28:27.0
Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo in San Diego, Calif., USA, Jan. 29-31.
Industry News | 2011-04-07 20:23:54.0
Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.
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