Industry News: temporary masking materials market (Page 1 of 7)

DuPont Electronic Technologies To Appoint Insulectro as National Distributor for Circuit Materials

Industry News | 2003-06-16 08:33:59.0

This action is part of the DuPont strategy to build on its leadership position in circuit materials, by expanding and strengthening the level of service and support available to its customers.

SMTnet

DuPont Electronic Technologies' Printed Circuit Materials Division Announces Price Increase for Riston� Photopolymer Dry Film Resists

Industry News | 2003-06-04 08:27:58.0

DuPont cites rising raw material, transportation and energy costs as reasons for the increase.

SMTnet

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2015-08-16 09:43:18.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.

Surface Mount Technology Association (SMTA)

IPC Calls for Participation in Electronics Materials Forum

Industry News | 2020-02-18 14:50:19.0

IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for Electronics Materials Forum Presentations sought on emerging technologies

Industry News | 2019-04-14 18:51:44.0

IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.

Association Connecting Electronics Industries (IPC)

Long-time IPC Volunteer, Doug Pauls Inducted into IPC Hall of Fame

Industry News | 2017-02-16 19:40:34.0

In recognition of his extraordinary contributions to IPC and the electronics industry, Doug Pauls, principal materials and process engineer, Rockwell Collins, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® on Tuesday, February 14 at the San Diego Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.

Association Connecting Electronics Industries (IPC)

Four IPC Global Statistical Programs Now Open

Industry News | 2015-03-11 14:26:45.0

IPC’s global statistical programs for the laminate, solder, process consumables and assembly equipment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC-member companies as a benefit of membership.

Association Connecting Electronics Industries (IPC)

IPC Conference to “Clean Up” Reliability Problems

Industry News | 2013-10-28 16:31:54.0

IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

Nordson Electronics Solutions wins Global Technology award for the ASYMTEK Select Coat SL-1040 Conformal Coating System

Industry News | 2024-11-04 15:16:00.0

The SL-1040 pairs new process control and new maintenance features, ideal for conformal coating in high-volume electronics manufacturing

Nordson Electronics Solutions

IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS

Industry News | 2012-04-27 19:20:10.0

PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.

Association Connecting Electronics Industries (IPC)

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