Industry News | 2015-08-16 09:43:18.0
The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.
Industry News | 2020-02-18 14:50:19.0
IPC invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Electronics Materials Forum – From Fabrication to Assembly – to be held June 18, 2020 in Raleigh, N.C., in conjunction with IPC SummerCom.
Industry News | 2019-04-14 18:51:44.0
IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.
Industry News | 2017-02-16 19:40:34.0
In recognition of his extraordinary contributions to IPC and the electronics industry, Doug Pauls, principal materials and process engineer, Rockwell Collins, was honored with the IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO® on Tuesday, February 14 at the San Diego Convention Center, the IPC Hall of Fame Award represents IPC's highest level of volunteer recognition.
Industry News | 2015-03-11 14:26:45.0
IPC’s global statistical programs for the laminate, solder, process consumables and assembly equipment industries are now open to new participants for 2015. The deadline for IPC members to sign up is April 15. Participation is free to IPC-member companies as a benefit of membership.
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2012-04-27 19:20:10.0
PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.
Industry News | 2012-03-07 19:35:54.0
IPC announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC’s top standards development oversight committee for the past two years.
Industry News | 2014-04-11 09:06:53.0
Renee Michalkiewicz, MIT, general manager, Trace Laboratories, Baltimore, has been elected chair of the IPC Technical Activities Executive Committee (TAEC) for a two-year term.
Industry News | 2024-05-17 19:04:32.0
The SL-1040 takes coating performance to the next level through improved yield and uptime with enhanced selectivity and flexibility for high-volume electronics manufacturing
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