Industry News | 2001-02-27 22:31:53.0
IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
Industry News | 2013-05-06 18:48:35.0
IPC – Association Connecting Electronics Industries® announces an ambitious technical agenda for the IPC/FED Conference on Embedded Components.
Industry News | 2012-05-09 13:57:33.0
SMTA China announced the Best and Excellent Paper and the Best and Excellent Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China Annual Breakfast Reception and Recognition Ceremony,
Industry News | 2013-03-29 07:29:36.0
IPC – Association Connecting Electronics Industries® has opened registration for the IPC/FED Conference on Embedded Components, a forum for designers, manufacturers, suppliers and end-users of embedded component technologies to discuss the latest technological advancements.
Industry News | 2020-07-27 11:12:23.0
Columbus, Ohio - Engineered Vision announces the release of the Flex-Bot: A New Generation of Vision Flex Feeding Technology! The Flex-Bot provides a solution to a previously unsolved manufacturing dilemma of high mix part feeding. This limitation has stifled manufacturers ability to automate, leaving manual labor in charge of dull and monotonous part feeding for anything less than ultra-high volume. The Flex-Bot offers an alternative to ultra-high volume single part bowl feeders with multiple part flexibility and additional orientation capability through robotic placement. With a standard hardware and software platform, there has been a greater than 40% reduction in engineering hours required to develop a custom application, and those savings are being passed on to the customer. With the ability to quickly adapt to an immense range of parts through Vibratory & Smart Auto-Tuning Technology as well as a point and click user interface, the Flex-Bot is the solution for today's current projects and tomorrow's ambitions.
Industry News | 2011-07-14 10:18:10.0
Sino IC Technology selected the Teradyne® UltraFLEX® to test RF, baseband and broadband devices. Sino IC Technology chose the UltraFLEX based on its high parallelism, superior accuracy and broad spectrum of instrumentation.
Industry News | 2011-07-14 10:30:38.0
Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.
Industry News | 2015-04-03 16:03:48.0
New versions of UltraFLEX digital and DC options provide greater pattern memory depth, data rates and accuracy to improve test quality and yield of ICs for mobile applications.
Industry News | 2007-10-29 17:19:26.0
MINNEAPOLIS - October 29, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will highlight its Flex Ultra High-Resolution automated optical inspection system (AOI) in booth A4.262 with GPS Technologies at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2008-04-07 21:55:46.0
MINNEAPOLIS - January 07, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will highlight its award winning Flex Ultra High-Resolution automated optical inspection system (AOI) in West Hall L1, booth 1A26 - at the upcoming NEPCON China/EMT China 2008 exhibition and conference, scheduled to take place April 8-11, 2008 in Shanghai, PR China.
