Industry News | 2015-04-03 15:56:25.0
Visit Teradyne in Booth#3101 at SEMICON China
Industry News | 2011-02-07 16:12:58.0
Teradyne, Inc. announced that registration is now open for the 2011 Teradyne Users Group (TUG) conference at the Hard Rock Hotel in San Diego, CA on May 2-4. Reza Zoughi, Ph.D. will present this year's keynote address: "Advances in Microwave and Millimeter Wave Imaging and System Development for Nondestructive Testing & Evaluation (NDT&E)."
Industry News | 2011-03-01 15:59:03.0
Acculogic's Test Programming Services (TPS) Division has selected the Teradyne TestStation LX to complement its extensive lineup of Teradyne and Agilent In-Circuit Test (ICT) systems.
Industry News | 2015-04-03 16:00:16.0
Ms. Johnson has more than 25 years of financial management experience in technology driven global businesses.
Industry News | 2015-04-03 15:57:56.0
Q4'14 Revenue of $323 million, up 13% year over year and full year revenue up 15% Quarterly cash dividend of $0.06 and $500 million share repurchase program announced
Industry News | 2010-11-03 21:54:19.0
Teradyne, Inc announced that Unisem has selected the ETS-88™ test system from Teradyne’s Eagle Test business unit, based on the platform’s scalability, flexibility and superior test economics.
Industry News | 2010-10-08 01:29:11.0
Teradyne, Inc. (NYSE: TER) announced that Realtek has selected the J750Ex for wafer sort and final test of their devices.
Industry News | 2024-05-27 12:50:23.0
Milestone achieved with V-Test, an independent third-party integrated circuit testing service company
Industry News | 2014-10-20 23:43:13.0
XJTAG today announced the release of the XJLink2-CFM and XJLink2-CFMx. The new modules provide Teradyne users with integrated access to XJTAG’s powerful test and programming tools, operating under the control of the TestStation™ test program.
Industry News | 2011-07-14 10:30:38.0
Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.
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