Industry News: teradyne (Page 5 of 15)

Acculogic Purchases Teradyne TestStation LX System

Industry News | 2011-03-01 15:59:03.0

Acculogic's Test Programming Services (TPS) Division has selected the Teradyne TestStation LX to complement its extensive lineup of Teradyne and Agilent In-Circuit Test (ICT) systems.

Acculogic Inc.

Mercedes Johnson Elected to Teradyne's Board of Directors

Industry News | 2015-04-03 16:00:16.0

Ms. Johnson has more than 25 years of financial management experience in technology driven global businesses.

Teradyne

Teradyne Reports Fourth Quarter and Fiscal Year 2014 Results

Industry News | 2015-04-03 15:57:56.0

Q4'14 Revenue of $323 million, up 13% year over year and full year revenue up 15% Quarterly cash dividend of $0.06 and $500 million share repurchase program announced

Teradyne

Unisem Selects Teradyne ETS-88 for Analog and Power Management Test

Industry News | 2010-11-03 21:54:19.0

Teradyne, Inc announced that Unisem has selected the ETS-88™ test system from Teradyne’s Eagle Test business unit, based on the platform’s scalability, flexibility and superior test economics.

Teradyne

Realtek Adopts J750Ex for Complex SOC Test

Industry News | 2010-10-08 01:29:11.0

Teradyne, Inc. (NYSE: TER) announced that Realtek has selected the J750Ex for wafer sort and final test of their devices.

Teradyne

Teradyne Marks 8,000th J750 Semiconductor Test System Shipment

Industry News | 2024-05-27 12:50:23.0

Milestone achieved with V-Test, an independent third-party integrated circuit testing service company

Teradyne

XJTAG Releases Boundary Scan for Teradyne TestStation

Industry News | 2014-10-20 23:43:13.0

XJTAG today announced the release of the XJLink2-CFM and XJLink2-CFMx. The new modules provide Teradyne users with integrated access to XJTAG’s powerful test and programming tools, operating under the control of the TestStation™ test program.

XJTAG

Teradyne Introduces New Instrumentation for the UltraFLEX Test System

Industry News | 2011-07-14 10:30:38.0

Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.

Teradyne

Teradyne Introduces LitePoint RF Instruments for J750 Wireless Test Solution

Industry News | 2015-04-03 15:48:41.0

J750-LitePoint Solutions Lower Test Costs for Wireless Connectivity and RF SOC Devices

Teradyne

UTAC Selects Teradyne J750Ex-HD Extending Test Coverage for Customers

Industry News | 2015-04-03 16:01:12.0

United Test and Assembly Center, Ltd. (UTAC) selected the J750EX-HD and placed a multi-system order.

Teradyne


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