Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
Industry News | 2014-08-07 18:05:48.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 9, 2014, from 9:30 am until 3:00 pm.
Industry News | 2014-09-06 19:01:47.0
he SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 9, 2014, from 9:30 am until 3:00 pm.
Industry News | 2010-04-10 02:37:34.0
IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas.
Industry News | 2009-04-15 23:12:38.0
BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.
Industry News | 2011-07-14 10:18:10.0
Sino IC Technology selected the Teradyne® UltraFLEX® to test RF, baseband and broadband devices. Sino IC Technology chose the UltraFLEX based on its high parallelism, superior accuracy and broad spectrum of instrumentation.
Industry News | 2011-07-14 10:30:38.0
Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.
Industry News | 2015-04-03 16:01:42.0
Sixth Generation RF Solution Focuses on Emerging LTE-Advanced and 802.11ac Challenges
Industry News | 2015-04-03 16:03:48.0
New versions of UltraFLEX digital and DC options provide greater pattern memory depth, data rates and accuracy to improve test quality and yield of ICs for mobile applications.
Industry News | 2015-04-03 16:04:35.0
New Real Time Audit (RTA) Tool for the UltraFLEX platform.