Industry News | 2011-02-07 16:12:58.0
Teradyne, Inc. announced that registration is now open for the 2011 Teradyne Users Group (TUG) conference at the Hard Rock Hotel in San Diego, CA on May 2-4. Reza Zoughi, Ph.D. will present this year's keynote address: "Advances in Microwave and Millimeter Wave Imaging and System Development for Nondestructive Testing & Evaluation (NDT&E)."
Industry News | 2015-04-03 15:59:27.0
New System Architected to Optimize Digital Bus and Real-time Testing of Circuit Boards, Assemblies and Systems
Industry News | 2015-04-03 15:48:41.0
J750-LitePoint Solutions Lower Test Costs for Wireless Connectivity and RF SOC Devices
Industry News | 2010-10-08 01:29:11.0
Teradyne, Inc. (NYSE: TER) announced that Realtek has selected the J750Ex for wafer sort and final test of their devices.
Industry News | 2011-07-14 10:30:38.0
Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.
Industry News | 2015-04-03 16:01:12.0
United Test and Assembly Center, Ltd. (UTAC) selected the J750EX-HD and placed a multi-system order.
Industry News | 2015-04-03 15:57:56.0
Q4'14 Revenue of $323 million, up 13% year over year and full year revenue up 15% Quarterly cash dividend of $0.06 and $500 million share repurchase program announced
Industry News | 2015-04-03 16:01:42.0
Sixth Generation RF Solution Focuses on Emerging LTE-Advanced and 802.11ac Challenges
Industry News | 2008-05-23 16:57:31.0
Pomona, CA - May 2008 - Everett Charles Technologies (ECT) Semiconductor Test Group (STG) recently attended the 25th annual Teradyne Users Group (TUG) Conference Vendor Fair 2008.
Industry News | 2015-04-03 16:02:29.0
The Oasis Toolset is designed to address the unique test challenges posed by complex semiconductor devices.
