Industry News | 2011-07-14 10:18:10.0
Sino IC Technology selected the Teradyne® UltraFLEX® to test RF, baseband and broadband devices. Sino IC Technology chose the UltraFLEX based on its high parallelism, superior accuracy and broad spectrum of instrumentation.
Industry News | 2011-07-14 10:30:38.0
Teradyne announces the availability of the UltraPAC80, UltraPin1600, UltraSerial10G and UltraVI80 instruments for the UltraFLEX® test system. These instruments increase the system's scalability and offer customers solutions to lower cost of test and improve time to market. New features also enable the testing of emerging SOC technology, including higher external data rates and new packaging technologies such as 3D System-In-Package.
Industry News | 2015-04-03 16:03:48.0
New versions of UltraFLEX digital and DC options provide greater pattern memory depth, data rates and accuracy to improve test quality and yield of ICs for mobile applications.
Industry News | 2015-04-03 16:01:42.0
Sixth Generation RF Solution Focuses on Emerging LTE-Advanced and 802.11ac Challenges
Industry News | 2015-04-03 16:04:35.0
New Real Time Audit (RTA) Tool for the UltraFLEX platform.
Industry News | 2011-02-07 16:12:58.0
Teradyne, Inc. announced that registration is now open for the 2011 Teradyne Users Group (TUG) conference at the Hard Rock Hotel in San Diego, CA on May 2-4. Reza Zoughi, Ph.D. will present this year's keynote address: "Advances in Microwave and Millimeter Wave Imaging and System Development for Nondestructive Testing & Evaluation (NDT&E)."
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