Industry News | 2014-10-06 17:27:56.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2016-09-15 18:08:04.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2012-11-02 09:04:14.0
IPC and SMTA jointly announce the agenda for Session 5 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2011-08-18 21:23:09.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Industry News | 2011-08-18 21:24:08.0
For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21–22, in Schaumburg, Ill., will feature five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
Association Connecting Electronics Industries (IPC)
