Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2013-01-16 11:21:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013
Industry News | 2015-01-21 21:05:20.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.
Industry News | 2019-05-05 19:06:43.0
IPC – Association Connecting Electronics Industries® and the Information Technology Industry Council (ITI) will host a conference series on “Critical and Emerging Environmental Product Requirements” in Boston, the Chicago area and San Jose on June 3, 5, and 7, respectively. The series will feature well-known United Kingdom (UK) regulators Carl Magness, product safety enforcement team leader, and Paul Tennant, product safety enforcement manager, both within the UK Office of Business, Energy and Industrial Strategy (BEIS), and Giuseppina Luvara, a policy officer within the European Commission’s Directorate General of Environment.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2010-12-01 14:28:16.0
With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.
Industry News | 2008-07-24 17:38:17.0
Scotts Valley, CA � 15 July, 2008 - Vertical Circuits, Inc.(VCI), a leading supplier of advanced 3D die-level interconnect solutions, today announced its recognition of Asymtek, a Nordson company (Nasdaq: NDSN) and leader in dispensing, coating and jetting technologies, as a �Partner in Innovation.� Asymtek's Axiom� automated dispensing system plays a key role in enabling the high-volume manufacturing capability for VCI's 3D vertical interconnect process.
Industry News | 2001-10-26 07:40:19.0
IPC has elected new officers.
Industry News | 2011-01-20 13:54:40.0
IPC will host the IPC Conference on HDI: Strategies for the 21st Century on March 1–2, 2011, at the National Electronics Museum in Baltimore, Md. Sponsored by Northrop Grumman Corporation, the two-day event includes technical workshops on March 1 and a full-day technical conference on March 2.
Industry News | 2013-04-16 15:45:33.0
Get information on developing industry practices at IPC Conflict Minerals Update and It’s Not Easy Being Green conferences
