Industry News: test and interface and boards (Page 3 of 104)

SMTA and CALCE Seeking Abstracts for 2nd Annual LED Assembly, Reliability, and Test Symposium

Industry News | 2016-04-12 15:29:42.0

The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 29 - December 1, 2016 at the Crowne Plaza Midtown in Atlanta, GA.

Surface Mount Technology Association (SMTA)

SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium

Industry News | 2017-05-30 19:40:07.0

The SMTA and CALCE are pleased to announce the LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 28 - November 30, 2017 at the Archie K. Davis Conference Center in Research Triangle Park, NC.

Surface Mount Technology Association (SMTA)

Joint IPC and UBM Canon Event Generates Sales and Solid Leads for Exhibitors and Valuable Technical Content and Contacts for Attendees

Industry News | 2010-10-30 02:09:14.0

The premiere of Electronics Midwest, a joint production of IPC – Association Connecting Electronics Industries® and UBM Canon, was a confirmed win-win-win success for exhibitors, attendees and organizations alike.

Association Connecting Electronics Industries (IPC)

SMTA and CALCE Announce New LED Assembly, Reliability, and Test Symposium

Industry News | 2015-03-03 21:14:08.0

The SMTA and CALCE are pleased to announce the new LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 17 - 19, 2015 at the Crowne Plaza Midtown in Atlanta, GA.

Surface Mount Technology Association (SMTA)

Nordson ASYMTEK Showcases 2-Component Large-Volume and Precision Dispensing and Coating Systems at SMT Nuremberg

Industry News | 2018-06-03 19:35:57.0

Nordson ASYMTEK will showcase a powerful array of dispensing and conformal coating systems and valves at SMT Nuremberg 2018, Nuremberg Germany, from June 5-7, in the SMARTec stand 4-401. In addition, the Spectrum™ II S2-900 precision fluid dispensing system and the Thermal Cure TC-2400 for curing underfill will be demonstrated in the Future Packaging line at Stand 5-434.

ASYMTEK Products | Nordson Electronics Solutions

IPC Workshops Highlight Updates to Key Industry Standards: IPC-A-610, J-STD-001, and IPC-A-600 and IPC-6012

Industry News | 2010-04-19 12:56:32.0

BANNOCKBURN, Ill., USA, - The world’s most widely used standards for printed boards and electronic assemblies were recently updated, providing new coverage for advanced technologies and processes as well as guidance on the new challenges that state-of-the-art can bring. To help industry members understand the ramifications of the changes to the standards that they and their customers depend on, IPC will host a number of full-day technology workshops, taught by the leaders of the task groups that worked on the standards’ revisions.

Association Connecting Electronics Industries (IPC)

IPC Releases T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Industry News | 2015-06-18 17:23:06.0

IPC Association Connecting Electronics Industries® has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever evolving standard provides common language of terms and definitions for the electronics industry.

Association Connecting Electronics Industries (IPC)

IPC Seeks Papers, Course Proposals and Exhibitors for Inaugural Electronic System Technologies Conference and Exhibition

Industry News | 2012-09-26 15:57:01.0

l IPC Electronic System Technologies Conference (ESTC) will take place May 20–23, 2013, with an accompanying exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas.

Association Connecting Electronics Industries (IPC)

IPC and High Density Package Users Group Sign MoU, Strengthening Collaboration and Value to Membership

Industry News | 2020-06-24 15:45:07.0

IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.

Association Connecting Electronics Industries (IPC)

Resources and Solutions to Address Challenges in Printed Boards and Electronics Manufacturing Focus of IPC Midwest

Industry News | 2011-06-20 19:55:16.0

IPC Midwest Conference & Exhibition will be held September 21–22, 2011, at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, Ill. After being a co-located event in Rosemont in 2010, IPC Midwest will be produced solely by IPC in 2011 and will bring focused, targeted and relevant information for the electronics manufacturing and printed boards industries.

Association Connecting Electronics Industries (IPC)


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