Association Connecting Electronics Industries (IPC)
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2023-01-30 16:14:03.0
At the 66th IPC Annual Meeting on January 24, held in conjunction with IPC APEX EXPO 2023, the IPC Board of Directors announced new and second-term members. Board members serve a four-year term, and the student board member serves a one-year term.
Industry News | 2018-05-01 19:25:27.0
Mil-aero and automotive engineers who want to increase their knowledge of electronics subjected to harsh use environments should attend IPC’s High Reliability Forum in Linthicum (Baltimore), Md., May 15-17, 2018.
Industry News | 2016-06-21 15:08:36.0
IPC's Validation Services Program has awarded an IPC-6012/IPC-A-600 Qualified Manufacturers Listing (QML) to Dongguan Shengyi Electronics Ltd., a manufacturer of single sided, double sided, and multilayer printed circuit boards in the Dongguan, Guangdong province of China. Dongguan Shengyi Electronics Ltd. is the first Chinese company to receive IPC's Validation Services QML for these standards.
Industry News | 2011-03-31 11:54:23.0
Over the past few years, pad cratering has become a vexing problem in lead-free assemblies, largely attributed to problems with the resin used to make a printed board. To help industry eliminate the defect and, at the same time, cut costs, IPC — Association Connecting Electronics Industries® has released IPC-9708, Test Methods for Characterization of PCB Pad Cratering.
Industry News | 2015-07-06 10:34:12.0
The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.” This special feature will take place during both days of the SMTA International Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois on September 29 - 30, 2015.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2016-04-07 08:47:23.0
The electronics industry has never settled on a single approach for moving printed board design data to manufacturing. With the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology, design engineers now have a way to organize and convey printed circuit board designs from CAD tools in a single intelligent file to manufacturing for fabrication, assembly and test.
