Industry News | 2012-10-22 16:10:06.0
Multitest announces that its Mercury™ contactor with Q-tip successfully passed a two-month evaluation at a US-based IDM with test operations in Southeast Asia with excellent first-pass yield for more than 500k insertions.
Industry News | 2012-05-01 19:12:41.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its 4000Plus Bondtester Pad Cratering Inspection System in Booth #212 at the upcoming Electronic Components and Technology Conference
Industry News | 2011-02-03 14:43:42.0
Multitest announces that Valts Treibergs, R&D Engineering Manager, and Chris Cuda, US Product Manager, will present "PCB Pad Wear Analysis at 0.4 mm Pitch ― the Story Continues…" at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 6-9, 2011 at the Hilton Phoenix East/Mesa Hotel in Mesa, AZ.
Industry News | 2010-09-14 17:17:30.0
Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test and production solutions, introduces its ThermoScan™ test technology. The ThermoScan™ sensor can be installed on a flying probe shuttle for general application or a probe module with Z-movement for more accurate measurement over the integrated circuits (ICs).
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2021-07-15 03:55:39.0
The latest fixtureless technology available for production and validation testing the most challenging Probe Cards
Industry News | 2017-03-14 10:44:55.0
Developed by XJTAG®, the free software for PADS® Schematic Design will significantly increase the Design for Test and Debug capabilities of the schematic capture and PCB design environment.
Industry News | 2016-10-11 13:26:07.0
CAMI Research Inc. (Acton, MA) announces another new board for its CableEye cable and harness testing systems. Populated with solder pads to accept both aligned and staggered, 1.25mm and 1.5mm pitch, surface mount and through hole (TH) connectors, the board addresses any market with a demand for board-to-board connections. Rated to 700Vdc/500Vac, the CB51 may be used on all CableEye models.
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