Industry News | 2010-12-07 14:53:07.0
GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.
Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2013-05-20 16:19:35.0
IPC – Association Connecting Electronics Industries® has teamed up with PCB Libraries, Inc.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2016-06-27 14:54:49.0
In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2014-02-21 16:59:49.0
IPC APEX EXPO® will advance many of the standards the PCB manufacturing and assembly industries rely on when it hosts more than 90 standards development committee meetings, March 23–27, 2014, at the Mandalay Bay Convention Center in Las Vegas.
Industry News | 2010-08-31 12:11:44.0
Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Electronics Assembly Quality & Reliability Conference in Budapest, Hungary on 6–7 October, 2010.
Industry News | 2017-08-06 19:29:36.0
IPC – Association Connecting Electronics Industries®, has announced the 2-17 Subcommittee has voted to use the Advanced Message Queuing Protocol (AMQP) as the transport protocol for machine to machine communication as part of the Connected Factory Initiative (CFX).
Industry News | 2016-08-13 20:26:34.0
The North American PCB Market Report, published last week by IPC – Association Connecting Electronics Industries® reported IPC’s final estimates of 2015 market size for rigid PCBs and flexible circuits in North America. Although North American PCB production decreased 4.3 percent in 2015 to $2.9 billion, the PCB market grew 1.4 percent to an estimated $3.4 billion. Growth in the North American PCB market was driven by flexible circuit sales, which increased in double digits in 2014, while rigid PCB sales declined slightly. The outlook for PCB sales in the coming year is for continued slow growth, with normal seasonal patterns.
