Industry News | 2021-11-11 10:56:53.0
Baja Bid is liquidating excess and unused assets from CASE Assembly via online auction. The bidding for this event is now open and the closing will begin at 1:00 pm EST on November 17th, 2021.
Industry News | 2021-11-17 09:28:16.0
Baja Bid is hosting an online auction event featuring surplus equipment from CASE Assembly. Universal Instruments, DEK, Heller and much more. The bidding period will begin closing today at 1pm EST.
Industry News | 2013-09-12 15:39:02.0
Subject-matter experts will provide insights into electronics reliability challenges during the IPC Conference on Solder and Reliability in Costa Mesa, Calif., November 13–14.
Industry News | 2017-01-24 18:45:22.0
The SMTA Capital Chapter is pleased to announce its first meeting of 2017 on February 23rd, scheduled from 5:00 pm to 8:00 pm at The Test Connection, 11400 Cronridge Drive, Suite H, Owings Mills, MD, 21117. The focus of this chapter meeting will be “Flying Probe in Modern Day” presented by Joe Folsom and Tim Dykes, The Test Connection, featuring a demo and tour of the facility.
Industry News | 2015-07-01 17:07:10.0
Seica Flying Probe Services now available at Island SMT
Industry News | 2020-01-07 11:09:15.0
IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.
Industry News | 2012-06-29 17:09:10.0
Electronic product and manufacturing trends continue to challenge both users and providers of test and inspection technologies at all levels of the supply chain.
Industry News | 2010-08-25 14:48:18.0
IPC — Association Connecting Electronics Industries® announces a new automated testing feature now available for purchasers of IPC electronics assembly DVD or OVT (Online Video Training) products. Automated testing can be used in conjunction with any of IPC’s extensive library of electronics assembly training videos, verifying understanding in key subject areas.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
